申请人:DAIWA CAN COMPANY
公开号:EP2246383A1
公开(公告)日:2010-11-03
To provide an imide oligomer, excellent in thermal moldability, having excellent heat resistance as a thermally-cured polyimide resin, and that is obtainable easily and inexpensively.
An imide oligomer including a nonaxisymmetric site derived from one nonaxisymmetric aromatic diamine molecule represented by below formula (1), only at a central portion of the oligomer chain,
in the formula (1), W is a direct bond, -O-, -CH2-, -C2H4-, -C(CH3)2-, -CF2-, -C2F4-, -C(CF3)2-, -C(=O)-, -NH-, -NH-C(=O)-, -C(=O)-NH-, -S-, -S(=O)-, or -S(=O)2-.
提供一种亚胺低聚物,它具有优异的热成型性,作为热固化聚酰亚胺树脂具有优异的耐热性,并且易于获得,成本低廉。
一种酰亚胺低聚物,包括一个非轴对称位点,该位点由一个非轴对称芳香族二胺分子衍生而成,如下式(1)所示,仅位于低聚物链的中心部分、
在式(1)中,W是直接键、-O-、-CH2-、-C2H4-、-C(CH3)2-、-CF2-、-C2F4-、-C(CF3)2-、-C(=O)-、-NH-、-NH-C(=O)-、-C(=O)-NH-、-S-、-S(=O)-或-S(=O)2-。