Provided is a composition for forming a conductive film, said composition containing: copper oxide particles (A) having an average particle size of 10-500 nm; copper particles (B) having an average particle size of 100-1000 nm; a polyol compound (C) which has two or more hydroxyl groups in the molecule; and at least one solvent (D) selected from the group consisting of water, and a water-soluble solvent. The ratio of the total mass (WA) of the copper oxide particles (A) to the total mass (WB) of the copper particles (B) is WA:WB=1:3-3:1, and the ratio of the sum total mass (WAB) of the copper oxide particles (A) and the copper particles (B) to the total mass (WC) of the polyol compound (C) is WAB:WC=20:1-2:1. The composition is capable of forming a conductive film which has high conductivity, and exhibits excellent adhesion to a substrate. Also provided is a conductive film manufacturing method using the composition.
本发明提供了一种用于形成导电膜的组合物,所述组合物包含:平均粒径为 10-500 nm 的
氧化铜颗粒(A);平均粒径为 100-1000 nm 的
铜颗粒(B);分子中含有两个或两个以上羟基的多元醇化合物(C);以及至少一种选自
水和
水溶性溶剂的溶剂(D)。
氧化铜颗粒(A)的总质量(WA)与
铜颗粒(B)的总质量(WB)之比为 WA:WB=1:3-3:1,
氧化铜颗粒(A)和
铜颗粒(B)的总质量之和(WAB)与多元醇化合物(C)的总质量(WC)之比为 WAB:WC=20:1-2:1。该组合物能够形成具有高导电性的导电膜,并且与基材具有良好的粘附性。此外,还提供了一种使用该组合物的导电膜制造方法。