propargyl hexanoate | 1932-94-1

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 英文名称: propargyl hexanoate
• 英文别名: Propin-(2)-ol-(1)-hexansaeureester；Prop-2-yn-1-yl hexanoate；prop-2-ynyl hexanoate
• CAS: 1932-94-1
• 化学式: C₉H₁₄O₂
• mdl: MFCD03640306
• 分子量: 154.209
• InChiKey: BCJLWLQDTCGSFZ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.1
• 重原子数：
  11
• 可旋转键数：
  6
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.666
• 拓扑面积：
  26.3
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为反应物：
  描述：

  propargyl hexanoate 在 copper (I) acetate 作用下， 以 1,4-二氧六环 、 丙酮 为溶剂， 反应 11.0h， 生成 N,N-Dimethylaminobutine-2-yl-caproic iodomethylate
  参考文献：
  名称：

  Synthesis and antimicrobial activity of cationic aminoacetylene fatty acid ester surfactants

  摘要：

  DOI：

  10.1007/bf00758764
• 作为产物：
  描述：

  N-hexanoylimidazole 、 2-丙炔-1-醇 以 四氢呋喃 为溶剂， 以3.1 g的产率得到propargyl hexanoate
  参考文献：
  名称：

  METHOD FOR PRODUCING A RADIOACTIVE TRACER

  摘要：

  一种制备具有放射性氟同位素的放射性示踪剂的方法，包括提供放射性示踪剂的前体，包括至少一个由标记实体完全或部分形成的离去基团，其中所述离去基团可以被氟离子移动，提供专门用于分子识别至少上述标记实体的分子印迹聚合物，将前体置于适宜于通过放射性氟离子移动离去基团的条件下的放射性氟离子源中，将步骤（iii）产生的混合物与分子印迹聚合物接触，在适宜于识别标记实体的条件下，获得含有放射性氟同位素的放射性示踪剂的溶液，该溶液是在步骤（iii）结束时获得的。

  公开号：

  US20130053607A1

文献信息

• NONAQUEOUS ELECTROLYTE SOLUTION AND ELECTROCHEMICAL ELEMENT USING SAME
  申请人：Abe Koji

  公开号：US20120171581A1

  公开（公告）日：2012-07-05

  Disclosed are a nonaqueous electrolytic solution of an electrolyte dissolved in a nonaqueous solvent, which contains a carboxylate represented by the following general formula (I) in an amount of from 0.01 to 10% by mass of the nonaqueous electrolytic solution; and an electrochemical element using it. (In the formula, R 1 represents an alkyl group, an alkenyl group, an alkynyl group, a cycloalkyl group, or a cyanoalkyl group; R 2 represents a hydrogen atom, an alkoxy group, a formyloxy group, an acyloxy group, an alkoxycarbonyloxy group, an alkanesulfonyloxy group, an arylsulfonyloxy group, an alkylsilyloxy group, a dialkylphosphoryloxy group, an alkoxy(alkyl)phosphoryloxy group, or a dialkoxyphosphoryloxy group; R 3 represents a hydrogen atom, —CH 2 COOR 6 , or an alkyl group; R 4 represents a hydrogen atom or an alkyl group; R 5 has the same meaning as R 2 , or represents a hydrogen atom, an alkyl group, or —CH 2 COOR 7 ; R 6 and R 7 each independently represent an alkyl group, an alkenyl group, an alkynyl group, or a cycloalkyl group; X represents —OR 8 , -A 2 -C≡Y 2 , -A 2 -C(═O)O-A 3 -C≡Y 2 , -A 2 -C(═O)O-A 4 or COOR 1 ; R 5 is the same as R 1 ; A 1 to A 3 each independently represent an alkylene group; A 4 represents an alkyl group; Y 2 represents CH or N; m indicates an integer of from 0 to 4; n indicates 0 or 1.)

  本发明涉及一种非水电解质溶液，其中包含以下述通式（I）表示的羧酸盐，其质量占非水电解质溶液的0.01至10％；以及使用该电解质溶液的电化学元件。（在式中，R1表示烷基、烯基、炔基、环烷基或氰基烷基；R2表示氢原子、烷氧基、甲酰氧基、酰氧基、烷氧羰基氧基、烷基磺酰氧基、芳基磺酰氧基、烷基硅氧基、二烷基磷酰氧基、烷氧（烷基）磷酰氧基或二烷氧基磷酰氧基；R3表示氢原子、-CH2COOR6或烷基；R4表示氢原子或烷基；R5与R2的含义相同，或表示氢原子、烷基或-CH2COOR7；R6和R7各自独立地表示烷基、烯基、炔基或环烷基；X表示-OR8，-A2-C≡Y2，-A2-C（═O）O-A3-C≡Y2，-A2-C（═O）O-A4或COOR1；R5与R1的含义相同；A1至A3各自独立地表示烷基；A4表示烷基；Y2表示CH或N；m表示0至4的整数；n表示0或1。）
• Conductive and resitive material with electrical stability for use in electronics devices
  申请人：National Starch and Chemical Investment Holding Corporation

  公开号：EP1032038A2

  公开（公告）日：2000-08-30

  An composition with improved electrical stability for use in microelectronic applications comprises a polymeric resin, a conductive filler, optionally either a reactive or a nonreactive diluent, optionally an inert filler, and an oxygen scavenger or corrosion inhibitor or both to provide the electrical stability.

  一种用于微电子应用的具有更高电稳定性的组合物包括聚合物树脂、导电填料、可选的反应性或非反应性稀释剂、可选的惰性填料以及氧清除剂或腐蚀抑制剂或二者兼有，以提供电稳定性。
• Conductive and resistive materials with electrical stability for use in electronics devices
  申请人：National Starch and Chemical Investment Holding Corporation

  公开号：EP1231248A1

  公开（公告）日：2002-08-14

  An composition with improved electrical stability for use in microelectronic applications comprises a polymeric resin, a conductive filler, optionally either a reactive or a nonreactive diluent, optionally an inert filler, and an oxygen scavenger or corrosion inhibitor or both to provide the electrical stability. Alternatively, the composition may also include a low melting point metal filler component.

  一种用于微电子应用的具有更高电稳定性的组合物包括聚合物树脂、导电填料、反应性或非反应性稀释剂、惰性填料、氧清除剂或腐蚀抑制剂或二者兼有，以提供电稳定性。另外，该组合物还可包括低熔点金属填料成分。
• Compositions for use in electronics devices
  申请人：National Starch and Chemical Investment Holding Corporation

  公开号：EP1594351A2

  公开（公告）日：2005-11-09

  A fast curing composition that comprises a polymeric resin, a conductive filler and one or more near-infrared absorbing additives and optionally an oxygen scavenger or corrosion inhibitor or both, and other additives such as reactive or nonreactive diluents, inert fillers, and adhesion promoters. The composition may be conductive, resistive or anisotropically conductive. In another embodiment, this invention is a method for improving the cure speed of a composition by exposing the composition to a near infrared energy source.

  一种快速固化组合物，由聚合树脂、导电填料、一种或多种近红外吸收添加剂、氧清除剂或腐蚀抑制剂或两者，以及其他添加剂（如反应性或非反应性稀释剂、惰性填料和附着力促进剂）组成。组合物可以是导电的、电阻性的或异向导电的。在另一个实施方案中，本发明是一种通过将组合物暴露于近红外能量源来提高组合物固化速度的方法。
• Anisotropic conductive adhesive
  申请人：National Starch and Chemical Investment Holding Corporation

  公开号：EP1832636A1

  公开（公告）日：2007-09-12

  An anisotropic conductive adhesive that provides strong adhesion to metals and organic substrates to generate stable and reliable electric interconnects. The adhesive provides the benefits of short thermocompression bond time at low temperatures. The adhesive contains cationic curable resin, latent cationic catalyst that thermally cures the resin at high speeds and low temperatures, conductive filler, optionally a film forming thermoplastic solid resin and optionally nano size filler. The optional nano filler provides the benefit of reducing the coefficient of thermal energy mismatch, improving the adhesion strength and reducing the total heat of reaction for the system.

  一种各向异性导电粘合剂，可与金属和有机基底产生强大的粘合力，从而产生稳定可靠的电气互连。该粘合剂具有低温热压粘合时间短的优点。该粘合剂包含阳离子可固化树脂、可在高速低温条件下热固化树脂的潜阳离子催化剂、导电填料、可选的成膜热塑性固体树脂和可选的纳米级填料。可选的纳米填料具有降低热能失配系数、提高粘合强度和降低系统总反应热的优点。