Reactive photo acid-generating agent and heat-resistant photoresist composition with polyamide precursor
申请人:Korea Research Institute of Chemical Technology
公开号:US20030064315A1
公开(公告)日:2003-04-03
The present invention relates to a reactive photo acid-generating agent and a heat-resistant photoresist composition comprising the same. In particularly, the present invention relates to the heat-resistant photoresist composition comprising the photo acid-generating agent expressed by the following formula (1), which can increase the degree of polymerization, and polyamide oligomers having acetal or its cyclized derivatives, which have an ability of that light-exposed area is dissolved in the developer and light-unexposed area is convertible to a heat-resistant polymer in the latter heating process and thus, it can be used for passivation layer, buffer coat or layer-insulating film of the multilayer printed circuit board,
1
wherein
2
and R are the same as defined in the detailed description of the Invention.
本发明涉及一种活性光酸生成剂和由其组成的耐热光刻胶组合物。特别是,本发明涉及一种耐热光刻胶组合物,该组合物包含由下式(1)表示的光酸生成剂(可提高聚合度)和具有缩醛或其环化衍生物的聚酰胺低聚物,后者具有使受光区域溶解在显影剂中和使未受光区域在后一加热过程中转化为耐热聚合物的能力,因此可用于多层印刷电路板的钝化层、缓冲涂层或层绝缘膜、
1
其中
2
和 R 与本发明详细说明中所定义的相同。