[EN] GLYCOLATE OXIDASE INHIBITORS FOR THE TREATMENT OF DISEASE<br/>[FR] INHIBITEURS DE GLYCOLATE OXYDASE POUR LE TRAITEMENT D'UNE MALADIE
申请人:BIOMARIN PHARM INC
公开号:WO2020257487A1
公开(公告)日:2020-12-24
Described herein are compounds, methods of making such compounds, pharmaceutical compositions and medicaments containing such compounds, and methods of using such compounds to treat or prevent diseases or disorders associated with a defect in glyoxylate metabolism, for example a disease or disorder associated with the enzyme glycolate oxidase (GO) or alterations in oxalate metabolism. Such diseases or disorders include, for example, disorders of glyoxylate metabolism, including primary hyperoxaluria, that are associated with production of excessive amounts of oxalate.
[EN] COMPOUNDS AND METHODS FOR TREATING OXALATE-RELATED DISEASES<br/>[FR] COMPOSÉS ET MÉTHODES DE TRAITEMENT DE MALADIES LIÉES À L'OXALATE
申请人:OXALURX INC
公开号:WO2019165159A1
公开(公告)日:2019-08-29
Disclosed herein are compounds and compositions for modulating glycolate oxidase, useful for treating oxalate-related diseases, such as hyperoxaluria, where modulating glycolate oxidase is expected to be therapeutic to a patent in need thereof. Methods of modulating glycolate oxidase activity in a human or animal subject is also provided.
In Siebdruck verarbeitbare härtbare Zusammensetzung, ein gehärteter Überzug aus dieser Zusammensetzung und Verfahren zum Löten von Schaltkarten unter Verwendung dieser Zusammensetzung
申请人:International Business Machines
Corporation
公开号:EP0009190A1
公开(公告)日:1980-04-02
Die Erfindung betrifft eine im Siebdruck verarbeitete Zusammensetzung mit einem Gehalt an einem epoxidierten Novolak, einem Phenoxypolymeren, einem flüssigen Anhydrid, kolloidalem Siliciumdioxid und einem Verdünnungsmittel. Die Zusammensetzung wird zur Beschichtung von Unterlagen, beispielsweise von gedruckten Schaltkarten, verwendet und dient als Lötmaske und Schutzüberzug.
Sealing composition, method for preparing said composition, integrated circuit module sealed therewith, and process for sealing
申请人:International Business Machines
Corporation
公开号:EP0053280A1
公开(公告)日:1982-06-09
A sealing composition containing an epoxy polymer; 4,4'-(2-acetoxy-1,3 glyceryl)bis anhydro trimellitate; a polyanhydride; and a solid filler; a method of preparation, and the sealing of integrated circuit modules therewith are provided.
A liquid epoxy composition containing a diglycidyl ether of a dihydric phenol and/or a diglycidyl ether of a tetrabrominated dihydric phenol, an epoxy with a functionality from 2.2 to 4, cycloaliphatic diamine curing agent, and thixotropic agent; and use thereof to fill drilled through-holes in circuit boards and cards and as isolation border around the edges of a board or card.