1,1-dimethyl-1-(2-hydroxybutyl)amine o-methoxybenzimide | 1169880-28-7

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯酚醚
• 英文名称: 1,1-dimethyl-1-(2-hydroxybutyl)amine o-methoxybenzimide
• 英文别名: N-[2-hydroxybutyl(dimethyl)azaniumyl]-2-methoxybenzenecarboximidate
• CAS: 1169880-28-7
• 化学式: C₁₄H₂₂N₂O₃
• 分子量: 266.34
• InChiKey: FPLBKZMGGUCCHA-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.9
• 重原子数：
  19
• 可旋转键数：
  6
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.5
• 拓扑面积：
  64.9
• 氢给体数：
  1
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  1,1-dimethyl-1-(2-hydroxybutyl)amine o-methoxybenzimide 、 三甲基乙酰氯 在 吡啶 作用下， 以 二氯甲烷 为溶剂， 反应 70.0h， 以0.82 g的产率得到1,1-dimethyl-1-(2-pivaloyloxybutyl)amine o-methoxybenzimide
  参考文献：
  名称：

  Latent curing agents, epoxy resin compositions containing the same, sealing materials, and organic EL displays

  摘要：

  该发明旨在提供潜在的固化剂，当与离子聚合化合物一起使用时，这些固化剂具有高低温固化性能，并在常温下表现出高储存稳定性。离子聚合化合物的潜在固化剂，每个固化剂都含有一种不含羟基的胺亚酰化合物，其N-N键能为100至210 kJ/mol，由B3LYP功能理论方法确定。

  公开号：

  US08466238B2
• 作为产物：
  描述：

  1,2-环氧丁烷 、 2-甲氧基苯甲酸甲酯 、 偏二甲肼 以 异丙醇 为溶剂， 反应 72.0h， 以12.12 g的产率得到1,1-dimethyl-1-(2-hydroxybutyl)amine o-methoxybenzimide
  参考文献：
  名称：

  Latent curing agents, epoxy resin compositions containing the same, sealing materials, and organic EL displays

  摘要：

  该发明旨在提供潜在的固化剂，当与离子聚合化合物一起使用时，这些固化剂具有高低温固化性能，并在常温下表现出高储存稳定性。离子聚合化合物的潜在固化剂，每个固化剂都含有一种不含羟基的胺亚酰化合物，其N-N键能为100至210 kJ/mol，由B3LYP功能理论方法确定。

  公开号：

  US08466238B2

文献信息

• LATENT CURING AGENTS, EPOXY RESIN COMPOSITIONS CONTAINING THE SAME, SEALING MATERIALS, AND ORGANIC EL DISPLAYS
  申请人：Tamatani Hiroaki

  公开号：US20100253213A1

  公开（公告）日：2010-10-07

  The invention aims to provide latent curing agents which exert high low-temperature curing properties when used together with ionically polymerizable compounds and which exhibit high storage stability at room temperature. Latent curing agents for ionically polymerizable compounds which agents each contain a hydroxyl-free amine imide compound having an N—N bond energy of 100 to 210 kJ/mol as determined by B3LYP functional theory method.
• THERMAL BASE GENERATOR, THERMOSETTING RESIN COMPOSITION, CURED FILM, CURED FILM MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE
  申请人：FUJIFILM Corporation

  公开号：US20170101521A1

  公开（公告）日：2017-04-13

  Provided are a thermal base generator which is capable of performing cyclization of a. thermosetting resin at a low temperature and with which a thermosetting resin composition having excellent stability can be prepared, a thermosetting resin composition, a cured film, a cured film manufacturing method, and a semiconductor device. The thermal base generator includes at least one selected from an acidic compound which generates a base in a case of being heated to 40° C. or higher, and an ammonium salt containing an anion having a pKa1 of 0 to 4 and an ammonium cation. The acidic compound is preferably an ammonium salt and/or a compound represented by the following General Formula (1), in which A 1 represents a p-valent organic group, R 1 represents a monovalent organic group, L 1 represents an (m+1)-valent organic group, m represents an integer of 1 or more, and p represents an integer of 1 or more.
• US8466238B2
  申请人：——

  公开号：US8466238B2

  公开（公告）日：2013-06-18
• Latent curing agents, epoxy resin compositions containing the same, sealing materials, and organic EL displays
  申请人：Tamatani Hiroaki

  公开号：US08466238B2

  公开（公告）日：2013-06-18

  The invention aims to provide latent curing agents which exert high low-temperature curing properties when used together with ionically polymerizable compounds and which exhibit high storage stability at room temperature. Latent curing agents for ionically polymerizable compounds which agents each contain a hydroxyl-free amine imide compound having an N—N bond energy of 100 to 210 kJ/mol as determined by B3LYP functional theory method.

  该发明旨在提供潜在的固化剂，当与离子聚合化合物一起使用时，这些固化剂具有高低温固化性能，并在常温下表现出高储存稳定性。离子聚合化合物的潜在固化剂，每个固化剂都含有一种不含羟基的胺亚酰化合物，其N-N键能为100至210 kJ/mol，由B3LYP功能理论方法确定。