PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PLATED FORMED PRODUCT
申请人:JSR CORPORATION
公开号:US20220146932A1
公开(公告)日:2022-05-12
The present invention is a photosensitive resin composition including an alkali-soluble resin (A), a polymerizable compound (B), a photoradical polymerization initiator (C), and a solvent (D), in which the polymerizable compound (B) contains at least one kind (B1) selected from a compound represented by the following formula (1) and a compound represented by the following formula (3), having specific Rs, and a content ratio of the compound (B1) contained in the photosensitive resin composition is 15 to 50% by mass. The photosensitive resin composition of the present invention can form a thick-film resist pattern having excellent sensitivity and resolution, and by using the thick-film resist pattern, a plated formed product can be miniaturized.