Process for coating thermoplastic substrates with a coating composition containing a non-aggressive solvent
申请人:——
公开号:US20010053417A1
公开(公告)日:2001-12-20
A process for coating a thermoplastic substrate which comprises applying a solvent based coating composition to the substrate and curing the coating composition at ambient temperature to 125° C. to form a uniform smooth film on the substrate;
wherein the coating composition contains about 45-80% by weight of a film forming binder and 20-55% by weight of an organic liquid carrier; wherein the binder contains
(A) 40-90% by weight, based on the weight of the binder, of a polymer selected from the following: acrylic polyol, polyester polyol, polyether polyol or a polyurethane polyol; and
(B) 10-60% by weight, based on the weight of the binder, of an organic polyisocyanate crosslinking agent; and
wherein the organic liquid carrier used in the coating composition comprises at least 50% by weight, based on the weight of the organic liquid carrier used in the coating composition, of tertiary butyl acetate; the process of this invention also can be used to apply lacquers, i.e., coating composition that do not contain a crosslinking agent such as a polyisocyanate.
一种涂覆热塑性基材的工艺,包括将溶剂型涂料组合物涂覆到基材上,并在环境温度至 125°C 下固化涂料组合物,以便在基材上形成均匀光滑的薄膜;
其中涂层组合物含有约 45-80%(按重量计)的成膜粘合剂和 20-55%(按重量计)的有机液体载体;其中粘合剂含有
(A) 以粘合剂重量计,40-90%(以重量计)选自下列的聚合物:丙烯酸多元醇、聚酯多元醇、聚醚多元醇或聚氨酯多元醇;和
(B) 10-60%(以粘合剂重量计)的有机多异氰酸酯交联剂;以及
本发明的工艺也可用于涂漆,即不含多异氰酸酯等交联剂的涂料组合物。