申请人:Daicel Chemical Industries, Ltd.
公开号:EP0999474A1
公开(公告)日:2000-05-10
The photoresist resin composition comprises a polymer having an adamantane skeleton represented by the following formula and a photoactive acid precursor:
wherein R1 represents a hydrogen atom or a methyl group; R2, R3, and R4 are the same or different from each other, each representing a hydrogen atom, a halogen atom, an alkyl group, a hydroxyl group, a hydroxylmethyl group, a carboxyl group, a functional group which forms a hydroxyl group, a hydroxymethyl group or a carboxyl group by elimination with an acid; at least one of the substituents R2 to R4 is the functional group defined above; X represents an ester bond or an amide bond; and each of m and n is 0 or 1.
The above photoresist resin composition is highly resistant to an etching solution, solubilizable by irradiation with light, and capable of giving minute patterns.
光致抗蚀剂树脂组合物由具有下式所示金刚烷骨架的聚合物和光活性酸前体组成:
其中 R1 代表氢原子或甲基;R2、R3 和 R4 彼此相同或不同,各自代表氢原子、卤素原子、烷基、羟基、羟甲基、羧基、通过与酸消去形成羟基、羟甲基或羧基的官能团;取代基 R2 至 R4 中至少有一个是上文定义的官能团; X 代表酯键或酰胺键;以及 m 和 n 均为 0 或 1。
上述光刻胶树脂组合物对蚀刻溶液有很强的抵抗力,在光照射下可溶解,并能产生微小的图案。