Method for forming thermally conductive thermal radical cure silicone compositions
申请人:Dow Silicones Corporation
公开号:US10370574B2
公开(公告)日:2019-08-06
A method for forming a thermally conductive thermal radical cure silicone composition comprising (I) a clustered functional polyorganopolysiloxane; optionally (II) a silicone reactive diluent, (III) a filler comprising a thermally conductive filler, (III′) a filler treating agent, and (IV) a radical initiator is provided. In this method, the clustered functional polyorganosiloxane (I) and the optional silicone reactive diluent (II) are premade prior to their addition to respective components (III), (III′) and (IV).
本发明提供了一种形成导热热自由基固化有机硅组合物的方法,该组合物包括(I)聚簇功能性聚有机硅氧烷;可选的(II)有机硅活性稀释剂,(III)由导热填料组成的填料,(III′)填料处理剂,以及(IV)自由基引发剂。在该方法中,簇状功能性聚有机硅氧烷(I)和任选的硅氧烷活性稀释剂(II)在加入到各自的组分(III)、(III′)和(IV)之前是预先制备好的。