A heat-resistant negative photoresist composition comprising a resin component having a structural unit represented by formula (I):
wherein the arrows, R1 and R2 are the same as defined hereinbefore, and a compound which becomes basic upon irradiation with actinic rays, represented by formula (II):
wherein R3 to R6 and X1 to X4 are the same as defined hereinbefore, a photosensitive substrate obtained by coating a substrate with the heat-resistant composition, and a process for forming a negative pattern using the heat-resistant negative photoresist composition.
一种耐热负片光刻胶组合物,包含一种具有式 (I) 所示结构单元的
树脂成分:
其中箭头、R1 和 R2 与前述定义相同,以及一种在用放 射线照射时变成碱性的化合物,由式(II)表示:
其中 R3 至 R6 和 X1 至 X4 与前述定义相同;通过在基底上涂覆该耐热组合物而获得的光敏基底;以及使用该耐热负片光刻胶组合物形成负片图案的工艺。