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10-(p-hydroxyphenyl)octadecanoic acid

中文名称
——
中文别名
——
英文名称
10-(p-hydroxyphenyl)octadecanoic acid
英文别名
9-(4-Hydroxyphenyl)octadecanoic acid
10-(p-hydroxyphenyl)octadecanoic acid化学式
CAS
——
化学式
C24H40O3
mdl
——
分子量
376.58
InChiKey
RYRWHOPGWVWVGW-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    9.1
  • 重原子数:
    27
  • 可旋转键数:
    17
  • 环数:
    1.0
  • sp3杂化的碳原子比例:
    0.71
  • 拓扑面积:
    57.5
  • 氢给体数:
    2
  • 氢受体数:
    3

反应信息

  • 作为反应物:
    描述:
    10-(p-hydroxyphenyl)octadecanoic acid氯化亚砜三氟化硼乙醚三乙胺 作用下, 以 乙醇N,N-二甲基甲酰胺 为溶剂, 反应 22.0h, 生成
    参考文献:
    名称:
    BIOBASED-FATTY ACID ARGINATES
    摘要:
    A biobased fatty acid arginate may be synthesized according to the disclosed process by combining arginine and a fatty acid. The fatty acid arginate may have certain beneficial properties, such as surfactant properties or acting as an antimicrobial agent.
    公开号:
    US20220274918A1
  • 作为产物:
    描述:
    油酸苯酚对甲苯磺酸 作用下, 反应 8.0h, 生成 10-(p-hydroxyphenyl)octadecanoic acid
    参考文献:
    名称:
    METHODS OF USING PHENOLIC FATTY ACID COMPOUND ON A NON-PHENOLIC POLYMER
    摘要:
    本发明涉及一种制备酚脂肪酸化合物的方法,其具有降低酚酸酯含量的特点。本发明还涉及一种将酚树脂与非酚聚合物(例如合成织物)化学键合的方法。该方法包括将酚脂肪酸化合物与非酚聚合物接触,以将羟基苯基功能基引入非酚聚合物中;并使非酚聚合物中所含的羟基苯基功能基与能够形成酚树脂的酚树脂或酚交联剂组合物反应,以将酚树脂与非酚聚合物化学键合。本发明特别适用于制备合成织物增强的制品,如合成织物增强橡胶制品、电路板基板或玻璃纤维制品。
    公开号:
    US20170204559A1
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文献信息

  • ANTIMICROBIAL PHENOLIC FATTY ACID-BASED EPOXY CURING AGENTS FOR EPOXIES
    申请人:The United States of America, as represented by the Secretary of Agriculture
    公开号:US20210094905A1
    公开(公告)日:2021-04-01
    Compositions containing at least one compound of formula I where R1 is a phenolic compound (e.g., simple phenol, creosote, thymol, or carvacrol), and where R2 is a polyamine (e.g., ethylenediamine (EDA), diethylenetriamine (DETA), triethylenetetramine (TETA), tetraethylenepentamine (TEPA), hexamethylenediamine (HDA)); and optionally a carrier; the compositions may additionally contain at least one epoxy resin. Methods for killing microorganisms involving contacting the microorganisms with an effective microorganism killing amount of the above composition. Compositions containing at least one compound produced by a method involving reacting phenolic-branched chain fatty acid methyl ester with at least one polyamine.
    含有至少一个化合物I的组合物,其中R1是苯酚类化合物(例如,简单苯酚、煤焦油、百里香酚或香芹酚),而R2是多胺(例如,乙二胺(EDA)、双乙烯三胺(DETA)、三乙烯四胺(TETA)、四乙烯五胺(TEPA)、六亚甲基二胺(HDA));并且可选的载体;该组合物还可以包含至少一种环氧树脂。用上述组合物接触微生物以杀灭微生物的方法。含有至少一种由将苯酚支链脂肪酸甲酯与至少一种多胺反应制得的化合物的组合物。
  • METHODS OF USING PHENOLIC FATTY ACID COMPOUND ON A NON-PHENOLIC POLYMER
    申请人:SI GROUP, INC.
    公开号:US20170204559A1
    公开(公告)日:2017-07-20
    This invention relates to a process for making phenolic fatty acid compounds having a reduced phenolic ester content. The invention also relates to method for chemically bonding a phenolic resin with a non-phenolic polymer (e.g., a synthetic fabric). The method comprises contacting a phenolic fatty acid compound with a non-phenolic polymer to introduce a hydroxy phenyl functional group into the non-phenolic polymer; and reacting the hydroxy phenyl functional group contained in the non-phenolic polymer with a phenolic resin or a phenolic crosslinker composition capable of forming a phenolic resin, to chemically bond the phenolic resin with the non-phenolic polymer. The invention is particularly useful for making a synthetic fabric-reinforced article, such as synthetic fabric-reinforced rubber article, circuit board substrate, or fiberglass.
    本发明涉及一种制备酚脂肪酸化合物的方法,其具有降低酚酸酯含量的特点。本发明还涉及一种将酚树脂与非酚聚合物(例如合成织物)化学键合的方法。该方法包括将酚脂肪酸化合物与非酚聚合物接触,以将羟基苯基功能基引入非酚聚合物中;并使非酚聚合物中所含的羟基苯基功能基与能够形成酚树脂的酚树脂或酚交联剂组合物反应,以将酚树脂与非酚聚合物化学键合。本发明特别适用于制备合成织物增强的制品,如合成织物增强橡胶制品、电路板基板或玻璃纤维制品。
  • Methods of using phenolic fatty acid compound on a non-phenolic polymer
    申请人:SI GROUP, INC.
    公开号:US10030332B2
    公开(公告)日:2018-07-24
    This invention relates to a process for making phenolic fatty acid compounds having a reduced phenolic ester content. The invention also relates to method for chemically bonding a phenolic resin with a non-phenolic polymer (e.g., a synthetic fabric). The method comprises contacting a phenolic fatty acid compound with a non-phenolic polymer to introduce a hydroxy phenyl functional group into the non-phenolic polymer; and reacting the hydroxy phenyl functional group contained in the non-phenolic polymer with a phenolic resin or a phenolic crosslinker composition capable of forming a phenolic resin, to chemically bond the phenolic resin with the non-phenolic polymer. The invention is particularly useful for making a synthetic fabric-reinforced article, such as synthetic fabric-reinforced rubber article, circuit board substrate, or fiberglass.
    本发明涉及一种制造酚酯含量降低的酚脂肪酸化合物的工艺。本发明还涉及将酚醛树脂与非酚醛聚合物(如合成织物)进行化学键合的方法。该方法包括将酚类脂肪酸化合物与非酚类聚合物接触,在非酚类聚合物中引入羟苯基官能团;将非酚类聚合物中所含的羟苯基官能团与酚醛树脂或能形成酚醛树脂的酚醛交联剂组合物反应,使酚醛树脂与非酚类聚合物化学键合。本发明特别适用于制造合成纤维增强制品,如合成纤维增强橡胶制品、电路板基材或玻璃纤维。
  • METHODS OF USING A PHENOLIC FATTY ACID COMPOUND ON A NON-PHENOLIC POLYMER
    申请人:SI Group, Inc.
    公开号:EP3116940B1
    公开(公告)日:2020-02-26
  • METHODS OF USING A PHENOLIC FATTY ACID COMPOUND ON A SYNTHETIC FABRIC MATERIAL
    申请人:SI GROUP, INC.
    公开号:US20170073884A1
    公开(公告)日:2017-03-16
    This invention relates to a process for making phenolic fatty acid compounds having a reduced phenolic ester content. The invention also relates to method for chemically bonding a phenolic resin with a non-phenolic polymer (e.g., a synthetic fabric). The method comprises contacting a phenolic fatty acid compound with a non-phenolic polymer to introduce a hydroxy phenyl functional group into the non-phenolic polymer; and reacting the hydroxy phenyl functional group contained in the non-phenolic polymer with a phenolic resin or a phenolic crosslinker composition capable of forming a phenolic resin, to chemically bond the phenolic resin with the non-phenolic polymer. The invention is particularly useful for making a synthetic fabric-reinforced article, such as synthetic fabric-reinforced rubber article, circuit board substrate, or fiberglass.
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