A liquid thermally expandable curable resin composition for use such as bonding by filling a clearance has difficulty in achieving both drying property and film forming property and also has a problem with storage stability. The problems were solved with a curable resin composition having the following composition. A curable resin composition comprises: (A) a film forming resin, (B) an epoxy resin, (C) an organic solvent, (D) thermally expandable particles, and (E) a curing agent ingredient for the (B). The (C) is selected from organic solvents having a boiling point of 100°C or less and being liquid at normal temperature and contains a combination of (C-1) an ester-based solvent and (C-2) one or more solvents selected from ketone-based solvents, ether-based solvents, and glycol-based solvents, and a content ratio between the (C-1) and the (C-2) in a mass ratio is in a range of (C-l)/(C-2) = 0.12 to 0.23.
用于填充间隙进行粘合等用途的液态热膨胀性可固化
树脂组合物在实现干燥性能和成膜性能方面存在困难,在储存稳定性方面也存在问题。具有以下组成的可固化
树脂组合物解决了这些问题。可固化
树脂组合物包括:(A) 成膜
树脂;(B) 环氧
树脂;(C) 有机溶剂;(D) 热膨胀性颗粒;(E) (B) 的固化剂成分。(C)选自沸点为 100℃或以下且在常温下为液态的有机溶剂,包含(C-1)酯基溶剂和(C-2)选自酮基溶剂、醚基溶剂和
乙二醇基溶剂的一种或多种溶剂的组合,且(C-1)和(C-2)的质量比范围为(C-l)/(C-2)=0.12 至 0.23。