An object of the present disclosure is to provide a paste that can suppress fluctuations in viscosity at a printing temperature to perform printing without unevenness, and is sintered fast even in an inert gas atmosphere such as nitrogen to form a highly accurate conductive wiring and a joined structure excellent in joining strength. The present disclosure provides an adhesive conductive paste for forming a conductive wiring and/or a joined structure to connect electronic elements, the adhesive conductive paste including a conductive particle and a solvent. The adhesive conductive paste contains, as the conductive particle, a silver particle (A) having an average particle size of 1 nm or greater and less than 100 nm and a silver particle (B) having an average particle size of 0.1 µm or greater and 10 µm or less, the silver particle (A) being a silver nanoparticle having a configuration in which a surface is coated with a protective agent containing amine, and
the adhesive conductive paste contains, as the solvent, a compound (C) represented by Formula (I) below:
Ra-O-(X-O)n-Rb ... (I)
where in Formula (I), Ra represents a monovalent group selected from a hydrocarbon group having from 1 to 6 carbon atom(s) and an acyl group, X represents a divalent group selected from a hydrocarbon group having from 2 to 6 carbon atoms, Rb represents a hydrogen atom or a monovalent group selected from a hydrocarbon group having from 1 to 6 carbon atom(s) and an acyl group, Ra and Rb may be the same, n represents an integer from 1 to 3.
本公开的目的是提供一种浆料,该浆料可抑制印刷温度下的粘度波动,从而进行无凹凸的印刷,并且即使在氮气等惰性气体环境中也能快速烧结,从而形成高精度的导电线路和接合强度极佳的接合结构。本公开提供了一种用于形成导电布线和/或连接电子元件的接合结构的粘合导电浆料,该粘合导电浆料包括导电粒子和溶剂。作为导电粒子,粘合导电浆料包含平均粒径大于或等于 1 纳米且小于 100 纳米的
银粒子 (A) 和平均粒径大于或等于 0.1 微米且小于或等于 10 微米的
银粒子 (B),
银粒子 (A) 是一种
银纳米粒子,其构造为表面涂有含胺的保护剂,并且
导电胶浆含有下式 (I) 所代表的化合物 (C) 作为溶剂:
Ra-O-(X-O)n-Rb ...... (I)
式(I)中,Ra 代表选自具有 1 至 6 个碳原子的烃基和酰基的一价基团,X 代表选自具有 2 至 6 个碳原子的烃基的二价基团,Rb 代表氢原子或选自具有 1 至 6 个碳原子的烃基和酰基的一价基团,Ra 和 Rb 可以相同,n 代表 1 至 3 的整数。