申请人:Fujita Kazuyoshi
公开号:US20090118431A1
公开(公告)日:2009-05-07
A main object of the present invention is to provide a resin composition having high heat resistance and a low dielectric constant, a varnish thereof, a resin film thereof and a semiconductor device using the same.
In the present invention, the object is achieved by a resin composition comprising a compound having a structure represented by formula (1) and a crosslinking agent:
wherein in formula (1), R
0
is a single bond or has a structure represented by formula (2); R
1
to R
8
are respectively any of hydrogen, a group having an alicyclic structure, an organic group having 1 to 10 carbon atoms other than the group having an alicyclic structure, a hydroxyl group and a carboxyl group; and “X” is any of —O—, —NHCO—, —CONH—, —COO— and —OCO—; further, wherein in formula (2), “Ar” is an aromatic group; “Y” is any of a single bond —O—, —S—, —OCO— and —COO—; “q” is an integer of 1 or more; R
9
is hydrogen or an organic group having 1 or more carbon atoms and may be identical with or different from each other when “q” is an integer of 2 or more; at least one of R
1
to R
8
is the group having an alicyclic structure when R
0
is a single bond; at least one of R
1
to R
9
is the group having an alicyclic structure when R
0
has the structure represented by formula (2); and “*” and “**” represent a position to be bonded to a different chemical structure.
本发明的主要目的是提供一种具有高耐热性和低介电常数的树脂组合物,其清漆,树脂膜以及使用该组合物的半导体器件。在本发明中,通过包括具有以下结构的化合物和交联剂的树脂组合物来实现该目标:其中在公式(1)中,R0是单键或具有以下结构的化合物(2);R1到R8分别为氢、具有脂环结构的基团、具有1到10个碳原子的有机基团(不包括具有脂环结构的基团)、羟基和羧基中的任意一种;“X”是以下任意一种:—O—、—NHCO—、—CONH—、—COO—和—OCO—;此外,在公式(2)中,“Ar”是芳香族基团;“Y”是以下任意一种:单键—O—、—S—、—OCO—和—COO—;“q”是1或更多的整数;当“q”是2或更多的整数时,R9是氢或具有1个或更多碳原子的有机基团,并且可以相同或不同;当R0是单键时,R1到R8中至少有一个是具有脂环结构的基团;当R0具有以下结构的化合物(2)时,R1到R9中至少有一个是具有脂环结构的基团;“*”和“**”表示要与不同化学结构结合的位置。