The present invention relates to a heat-curable composition comprising at least one epoxy monomer having two or three epoxy groups, which is not a silicon compound having at least one hydrolyzable group directly linked to the silicon atom, at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one group comprising an epoxy function linked to the silicon atom though a carbon atom, and/or a hydrolyzate thereof, at least one epoxy ring-opening catalyst, and at least one compound comprising at least two (2,2,6,6-tetramethyl-4-piperidyl)- groups in which the nitrogen atom can be substituted with an alkyl group, an alkoxy group or an oxyl group.
本发明涉及一种热固化组合物,该组合物包含至少一种具有两个或三个环氧基团的环氧单体,该环氧单体不是具有至少一个与
硅原子直接相连的可
水解基团的
硅化合物,至少一种含有至少一个
硅原子的环氧化合物,该环氧化合物具有至少一个与
硅原子直接相连的可
水解基团和至少一个包含通过碳原子与
硅原子相连的环氧官能团的基团、和/或其
水解物,至少一种环氧开环催化剂,以及至少一种包含至少两个(2,2,6,6-四甲基-4-
哌啶基)基团的化合物,其中氮原子可被烷基、烷氧基或氧基取代。