1,2-二氢-4-羟基-6-甲基-3H-吡唑并[3,4-B]吡啶-3-酮 | 116081-20-0

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡唑并吡啶类
• 中文名称: 1,2-二氢-4-羟基-6-甲基-3H-吡唑并[3,4-B]吡啶-3-酮
• 英文名称: 4-Hydroxy-6-methyl-1H-pyrazolo[3,4-b]pyridin-3(2H)-one
• 英文别名: 6-methyl-2,7-dihydro-1H-pyrazolo[3,4-b]pyridine-3,4-dione
• CAS: 116081-20-0
• 化学式: C₇H₇N₃O₂
• mdl: MFCD09838953
• 分子量: 165.151
• InChiKey: KVVBXGWVNVZOTF-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.2
• 重原子数：
  12
• 可旋转键数：
  0
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.142
• 拓扑面积：
  70.2
• 氢给体数：
  3
• 氢受体数：
  4

安全信息

• 海关编码：
  2933990090

反应信息

• 作为产物：
  描述：

  ethyl (Z)-3-hydroxy-2-butenoate 、 3-氨基-5-羟基吡唑 以 溶剂黄146 为溶剂， 反应 0.5h， 以85.8%的产率得到1,2-二氢-4-羟基-6-甲基-3H-吡唑并[3,4-B]吡啶-3-酮
  参考文献：
  名称：

  Erian, Ayman Wahba; El-Gohary; Manhi, Pharmazie, 1998, vol. 53, # 11, p. 748 - 751

  摘要：

  DOI：

文献信息

• Polishing composition and polishing method using the same
  申请人：FUJIMI INCORPORATED

  公开号：EP2348080A1

  公开（公告）日：2011-07-27

  A polishing composition of the present invention contains an oxidant, an anticorrosive, and a surfactant comprising a compound represented by Chemical Formula 1: One to three of R1 to R5 in Chemical Formula 1 are alkyl groups, alkynyl groups, alkenyl groups, aryl groups, or arylalkylene groups, one is a hydrogen atom or an alkyl group having 1 to 9 carbon atoms, and the remainder are hydrogen atoms. OR6 is oxyethylene, oxypropylene, or a random or block conjugate of oxyethylene and oxypropylene. n is an integer of 1 or more. X is an OSO3- group, an OPO32- group, or an OH group.

  本发明的抛光组合物含有氧化剂、防腐剂和表面活性剂，其中表面活性剂由化学式 1 所代表的化合物组成： 化学式 1 中 R1 至 R5 的一至三个是烷基、炔基、烯基、芳基或芳基亚烷基，一个是氢原子或具有 1 至 9 个碳原子的烷基，其余是氢原子。OR6 是氧乙烯、氧丙烯或氧乙烯和氧丙烯的无规或嵌段共轭物。X 是 OSO3- 基团、OPO32- 基团或 OH 基团。
• Polishing composition and polishing method
  申请人：FUJIMI INCORPORATED

  公开号：EP2374852A1

  公开（公告）日：2011-10-12

  A polishing composition contains a polishing accelerator, a water-soluble polymer including a constitutional unit originating from a polymerizable compound having a guanidine structure such as dicyandiamide, and an oxidant. The water-soluble polymer may be a water-soluble polymer including a constitutional unit originating from dicyandiamide and a constitutional unit originating from formaldehyde, a diamine or a polyamine.

  一种抛光组合物含有一种抛光促进剂、一种水溶性聚合物（包括源自具有胍结构（如双氰胺）的可聚合化合物的构型单元）和一种氧化剂。水溶性聚合物可以是一种水溶性聚合物，包括源自双氰胺的构型单元和源自甲醛、二胺或多胺的构型单元。
• POLISHING COMPOSITION AND POLISHING METHOD
  申请人：Fujimi Incorporated

  公开号：EP2605270A1

  公开（公告）日：2013-06-19

  A polishing composition contains a water-soluble polymer, a polishing accelerator, and an oxidizing agent. The water-soluble polymer is a polyamide-polyamine polymer having an amine value of 150 mg KOH/1 g·solid or greater.

  一种抛光组合物含有一种水溶性聚合物、一种抛光促进剂和一种氧化剂。水溶性聚合物是一种聚酰胺-聚胺聚合物，其胺值为 150 毫克 KOH/1 克固体或更高。
• POLISHING COMPOSITION
  申请人：Fujimi Incorporated

  公开号：EP2800124A1

  公开（公告）日：2014-11-05

  A polishing composition of the present invention is to be used for polishing an object including a metal portion or an interlayer insulation film. The polishing composition contains silica on which an organic acid, such as a sulfonic acid and a carboxylic acid, is immobilized and an oxidizing agent.

  本发明的抛光组合物用于抛光包括金属部分或夹层绝缘膜的物体。抛光组合物含有二氧化硅，二氧化硅上固定有有机酸（如磺酸和羧酸）和氧化剂。
• Polishing composition
  申请人：FUJIMI INCORPORATED

  公开号：US10144907B2

  公开（公告）日：2018-12-04

  The purpose of the present invention is to provide a means to sufficiently remove impurities remaining on the surface of a polishing object after CMP. The polishing composition of the present invention is a polishing composition which is used after polishing has been performed by using a polishing composition (A) including abrasive grains or an organic compound (A), and is characterized by including an organic compound (B) which includes at least one atom selected from the group consisting of a fluorine atom, an oxygen atom, a nitrogen atom, and a chlorine atom and has a molecular weight of 100 or more, a pH adjusting agent, and 0 to 1% by mass of abrasive grains.

  本发明的目的是提供一种在 CMP 之后充分去除抛光对象表面残留杂质的方法。 本发明的抛光组合物是一种抛光组合物，在使用包括磨粒或有机化合物（A）的抛光组合物（A）进行抛光后使用，其特征在于包括有机化合物（B），该有机化合物（B）包括至少一个选自由氟原子、氧原子、氮原子和氯原子组成的组中的原子，且分子量在 100 或以上；pH 值调节剂；以及 0 至 1%（质量百分比）的磨粒。