Polishing composition and method of fabricating semiconductor device using the same
申请人:SAMSUNG ELECTRONICS CO., LTD.
公开号:US11041097B2
公开(公告)日:2021-06-22
A polishing composition and a method of fabricating a semiconductor device using the same, the polishing composition including an abrasive; a first additive that includes a C5 to C30 hydrocarbon including an amide group and a carboxyl group or a C5 to C30 hydrocarbon including two or more amine groups; and a second additive that includes a sulfonic acid, a sulfonate, or a sulfonate salt.
一种抛光组合物和使用该组合物制造半导体器件的方法,该抛光组合物包括磨料;第一种添加剂,包括含有一个酰胺基团和一个羧基的 C5 至 C30 碳氢化合物或含有两个或两个以上胺基团的 C5 至 C30 碳氢化合物;以及第二种添加剂,包括磺酸、磺酸盐或磺酸盐盐。