A curable resin composition containing (a) a polymer having a plurality of alkenyl groups, (b) an organohydrogenpolysiloxane having a plurality of hydrosilyl groups, (c) a polymer having a plurality of alkynyl groups, and (d) a hydrosilylation catalyst is disclosed. The composition is stable at room temperature but curable at an elevated temperature.
本发明揭示了一种可治愈的
树脂组合物,包含(a)具有多个烯基基团的聚合物,(b)具有多个氢
硅基团的有机氢聚
硅氧烷,(c)具有多个炔基基团的聚合物,以及(d)一种氢
硅烷基化催化剂。该组合物在室温下稳定,但在升高温度下可治愈。