[EN] SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF<br/>[FR] COMPOSITION DE TRAITEMENT DE SURFACE POUR DU CUIVRE ET UN ALLIAGE DE CUIVRE ET SON UTILISATION
申请人:SHIKOKU CHEM
公开号:WO2012176591A1
公开(公告)日:2012-12-27
A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.