A thermosetting epoxy resin composition of one pack type is provided which contains as indispensable constituents (I) an epoxy resin containing more than one adjacent epoxy groups on the average in the molecule and (II) curing amount or curing-accelerating amount of a compound obtained by reacting (a) a specified amine/epoxy adduct with (b) phenolic , resin(s) and/or polyhydric phenol compound(s) in a weight ratio of (a) to (b) of 1/0.1 to 1/0.8. The composition of the present invention has excellent storage stability and it is curable at a relatively low temperature to form a cured product having excellent mechanical strength, adhesiveness and water resistance.
WILSON, STEPHEN R.;GUAZZARONI, MARIA E., J. ORG. CHEM. , 54,(1989) N3, C. 3087-3091
作者:WILSON, STEPHEN R.、GUAZZARONI, MARIA E.
DOI:——
日期:——
Thermally stable reactive hot melt urethane adhesive composition having a thermoplastic polymer, a compatible, curing urethane polyester polyol prepolymer and a tackifying agent