Highly Selective <i>Syn</i>
Addition of 1,3-Diones to Internal Ynamides Catalyzed by Zinc Iodide
作者:Rémi Plamont、Lionel V. Graux、Hervé Clavier
DOI:10.1002/ejoc.201701690
日期:2018.3.22
used as nucleophiles to perform additions to ynamides, highly selective hydroalkoxylation of internal ynamides is now described herein. Several catalytic systems were compared to carry out this transformation including transition metal-based catalysts or Lewis acids. ZnI2 was found to be both very active and highly selective giving only E adducts through a syn addition. Scope and limits investigation
IMIDE-LINKED MALEIMIDE AND POLYMALEIMIDE COMPOUNDS
申请人:Mizori Farhad G.
公开号:US20110130485A1
公开(公告)日:2011-06-02
The invention is directed to maleimide thermosets incorporating imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended maleimide compounds are prepared by the condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds. These compounds are then condensed with excess maleic anhydride to yield imide-extended maleimide compounds.
Compounds of formula (I), wherein the substituents are as defined in claim 1, are suitable for use as herbicides.
式(I)化合物,其中取代基如权利要求1中所定义,适用于作为除草剂。
METHOD OF SEALING SEMICONDUCTOR ELEMENT MOUNTED ON GOLD-PLATED PRINTED CIRCUIT BOARD
申请人:Tabei Eiichi
公开号:US20070104872A1
公开(公告)日:2007-05-10
Methods of sealing a semiconductor element are provided. The methods includes the steps of coating a semiconductor element mounted on a gold-plated printed circuit board with a curable silicone resin, and then curing the curable silicone resin. In a method, the gold-plated printed circuit board is subjected to preliminary treatment with a treatment agent including an acid anhydride group-containing alkoxysilane and/or a partial hydrolysis-condensation product thereof In another method, the curable silicone resin includes the treatment agent. The methods yield favorable adhesion upon sealing.
Imide-linked maleimide and polymaleimide compounds
申请人:Mizori G. Farhad
公开号:US20080075961A1
公开(公告)日:2008-03-27
The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved through the incorporation of imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended maleimide compounds are readily prepared by the condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds. These compounds are then condensed with excess maleic anhydride to yield imide-extended maleimide compounds.