[(丙-2-炔基)-2-乙酰氧基苯甲酸酯]二钴六羰基(Co-ASS),非甾体抗炎药阿司匹林®(ASS)的衍生物,对多种肿瘤细胞具有高度的细胞毒性。与阿司匹林®相比,[乙炔] Co 2(CO)6团簇大大增强了生物学作用。在这项研究中,我们评估了使用[环戊二烯基]金属羰基作为细胞毒性部分与一系列更广泛的金属:钼,锰,钴和铑。测试了所有化合物对乳腺癌(MCF-7,MDA-MB-231)和结肠癌(HT-29)细胞系的细胞毒性。在分离的同工酶上评估了它们对COX-1和COX-2的抑制作用。此外,对主要COX代谢物前列腺素E 2(PGE 2)在MDA-MB-231乳腺癌细胞中进行了定量。尽管纯的配体或ASS没有显示任何细胞毒性作用,但所有金属络合物均抑制了肿瘤细胞的生长。对COX-1和COX-2酶的抑制作用很低。仅Prop-Cp-ASS-Rh复合物(10μM)对COX-1造成了60%的重要抑制,对CO
[(丙-2-炔基)-2-乙酰氧基苯甲酸酯]二钴六羰基(Co-ASS),非甾体抗炎药阿司匹林®(ASS)的衍生物,对多种肿瘤细胞具有高度的细胞毒性。与阿司匹林®相比,[乙炔] Co 2(CO)6团簇大大增强了生物学作用。在这项研究中,我们评估了使用[环戊二烯基]金属羰基作为细胞毒性部分与一系列更广泛的金属:钼,锰,钴和铑。测试了所有化合物对乳腺癌(MCF-7,MDA-MB-231)和结肠癌(HT-29)细胞系的细胞毒性。在分离的同工酶上评估了它们对COX-1和COX-2的抑制作用。此外,对主要COX代谢物前列腺素E 2(PGE 2)在MDA-MB-231乳腺癌细胞中进行了定量。尽管纯的配体或ASS没有显示任何细胞毒性作用,但所有金属络合物均抑制了肿瘤细胞的生长。对COX-1和COX-2酶的抑制作用很低。仅Prop-Cp-ASS-Rh复合物(10μM)对COX-1造成了60%的重要抑制,对CO
[EN] METHOD AND MOLECULES<br/>[FR] MÉTHODE ET MOLÉCULES
申请人:MEDIMMUNE LLC
公开号:WO2018218093A1
公开(公告)日:2018-11-29
The present invention provides a bioconjugation method and compounds for use therein. The bioconjugation method comprises the step of conjugating a biological molecule containing a first unsaturated functional group with a payload comprising a second unsaturated functional group, wherein the first and second unsaturated functional groups are complementary to each other such that conjugation is a reaction of said functional groups via a Diels-Alder reaction which forms a cyclohexene ring.
DIENE/DIENOPHILE COUPLES AND THERMOSETTING RESIN COMPOSITIONS HAVING REWORKABILITY
申请人:Henkel IP & Holding GmbH
公开号:US20160002510A1
公开(公告)日:2016-01-07
Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.
Diene/dienophile couples and thermosetting resin compositions having reworkability
申请人:Henkel IP & Holding GmbH
公开号:US10472548B2
公开(公告)日:2019-11-12
Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.