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2-羟基-2-丙基戊酰胺 | 66461-81-2

中文名称
2-羟基-2-丙基戊酰胺
中文别名
——
英文名称
2-hydroxy-2-propyl-valeric acid amide
英文别名
C.C-Dipropyl-glycolsaeure-amid;4-Hydroxy-heptan-carbonsaeure-(4)-amid;2-Hydroxy-2-propyl-valeriansaeure-amid;2-Hydroxy-2-propylpentanamide
2-羟基-2-丙基戊酰胺化学式
CAS
66461-81-2
化学式
C8H17NO2
mdl
——
分子量
159.228
InChiKey
OBUVYAXCNNURRV-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    0.8
  • 重原子数:
    11
  • 可旋转键数:
    5
  • 环数:
    0.0
  • sp3杂化的碳原子比例:
    0.88
  • 拓扑面积:
    63.3
  • 氢给体数:
    2
  • 氢受体数:
    2

SDS

SDS:8a3a3a622600cabf5da727c69ca27b48
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反应信息

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文献信息

  • Curable compositions containing urethanes,and the use of the compositions in electrodeposition
    申请人:PPG INDUSTRIES, INC.
    公开号:EP0118743B1
    公开(公告)日:1987-06-16
  • LOW-TEMPERATURE CURING ADHESIVE COMPOSITIONS
    申请人:PPG Industries Ohio, Inc.
    公开号:EP3580253B1
    公开(公告)日:2021-04-07
  • [EN] LOW-TEMPERATURE CURING COATING COMPOSITIONS<br/>[FR] COMPOSITIONS DE REVÊTEMENT DURCISSANT À BASSE TEMPÉRATURE
    申请人:PPG IND OHIO INC
    公开号:WO2018148306A1
    公开(公告)日:2018-08-16
    The present invention is directed towards a coating composition comprising a film-forming polymer comprising active hydrogen-containing functional groups; a blocked polyisocyanate curing agent comprising a blocking group derived from a blocking agent comprising an alpha-hydroxy amide, ester or thioester; and a curing catalyst that does not contain tin, lead, iron, zinc or manganese. Also disclosed are coatings, coated substrates, and methods of coating a substrate.
  • [EN] LOW-TEMPERATURE CURING ADHESIVE COMPOSITIONS<br/>[FR] COMPOSITIONS ADHÉSIVES DURCISSABLES À BASSE TEMPÉRATURE
    申请人:PPG IND OHIO INC
    公开号:WO2018148323A1
    公开(公告)日:2018-08-16
    Disclosed herein is an adhesive composition comprising: an epoxy-containing component; and a blocked polyisocyanate curing agent comprising a blocking group derived from a blocking agent comprising an alpha-hydroxy amide, ester, or thioester, or a combination thereof. Also disclosed are methods for forming a bonded substrate with the adhesive composition. Also disclosed is an article comprising first and second substrates and the adhesive composition.
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