8-Hydroxychinolin-4-carbaldehyd-oxim | 71294-68-3

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 喹啉及其衍生物
• 英文名称: 8-Hydroxychinolin-4-carbaldehyd-oxim
• 英文别名: 4-(Hydroxyiminomethyl)quinolin-8-ol
• CAS: 71294-68-3
• 化学式: C₁₀H₈N₂O₂
• 分子量: 188.186
• InChiKey: IJEYDQUPDYDOLR-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.8
• 重原子数：
  14
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  65.7
• 氢给体数：
  2
• 氢受体数：
  4

文献信息

• Cleaning composition with corrosion inhibitor
  申请人：ENTEGRIS, INC.

  公开号：US11149235B2

  公开（公告）日：2021-10-19

  A cleaning composition and process for cleaning an in-process microelectronic device substrate, e.g., by post-chemical mechanical polishing (CMP) cleaning, to remove residue from a surface thereof, wherein the cleaning composition may be especially effective for cleaning a substrate surface that includes exposed metal such as cobalt, copper, or both, along with dielectric or low k dielectric material, and wherein the cleaning composition includes corrosion inhibitor to inhibit corrosion of the exposed metal.

  一种清洁组合物和工艺，用于清洁在制品微电子器件基板，例如通过化学机械抛光（CMP）后清洁，以去除其表面的残留物，其中清洁组合物对于清洁基板表面特别有效，该基板表面包括暴露金属，例如钴、铜或两者，以及介电或低k介电材料，其中清洁组合物包括腐蚀抑制剂，以抑制暴露金属的腐蚀。
• CLEANING COMPOSITION WITH CORROSION INHIBITOR
  申请人：Entegris, Inc.

  公开号：EP3824059A1

  公开（公告）日：2021-05-26
• [EN] CLEANING COMPOSITION WITH CORROSION INHIBITOR<br/>[FR] COMPOSITION DE NETTOYAGE À INHIBITEUR DE CORROSION
  申请人：ENTEGRIS INC

  公开号：WO2020018804A1

  公开（公告）日：2020-01-23

  A cleaning composition and process for cleaning an in-process microelectronic device substrate, e.g., by post-chemical mechanical polishing (CMP) cleaning, to remove residue from a surface thereof, wherein the cleaning composition may be especially effective for cleaning a substrate surface that includes exposed metal such as cobalt, copper, or both, along with dielectric or low k dielectric material, and wherein the cleaning composition includes corrosion inhibitor to inhibit corrosion of the exposed metal.