4-(叔丁基)-2,6-双(甲氧基甲基)苯酚 | 421546-91-0

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 中文名称: 4-(叔丁基)-2,6-双(甲氧基甲基)苯酚
• 英文名称: 2,6-di(methoxymethyl)-4-t-butylphenol
• 英文别名: 2,6-bis(methoxymethyl)-para-tert-butylphenol；4-(tert-Butyl)-2,6-bis(methoxymethyl)phenol；4-tert-butyl-2,6-bis(methoxymethyl)phenol
• CAS: 421546-91-0
• 化学式: C₁₄H₂₂O₃
• 分子量: 238.327
• InChiKey: SHDBJOYDLRRTRA-UHFFFAOYSA-N

物化性质

• 沸点：
  296.1±35.0 °C(Predicted)
• 密度：
  1.023±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  2.5
• 重原子数：
  17
• 可旋转键数：
  5
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.57
• 拓扑面积：
  38.7
• 氢给体数：
  1
• 氢受体数：
  3

安全信息

• 海关编码：
  2909500000
• 储存条件：
  室温

反应信息

• 作为反应物：
  描述：

  4-(叔丁基)-2,6-双(甲氧基甲基)苯酚 在 三乙胺 、 sodium hydroxide 作用下， 以 四氢呋喃 、 甲醇 为溶剂， 反应 8.0h， 生成
  参考文献：
  名称：

  Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, mask blanks including actinic ray-sensitive or radiation-sensitive film, pattern forming method and photomask

  摘要：

  一种感光或辐射敏感的树脂组合物，包括以下化合物（A）：通过与光化学或辐射照射产生酸的化合物，其中酸通过共价键与以下通式（M）表示的基团连接。在该式中，Y1和Y2各自独立地表示氢原子，烷基，环烷基，烯基，炔基，芳基或酰基。Z表示氢原子或取代基。*表示与化合物（A）的残基连接的连接位点。

  公开号：

  US09958775B2
• 作为产物：
  描述：

  甲醇 、 O-acetyl-2,6-bis(acetoxymethyl)-para-tert-butylphenol 在 对甲苯磺酸 作用下， 反应 0.5h， 以100%的产率得到4-(叔丁基)-2,6-双(甲氧基甲基)苯酚
  参考文献：
  名称：

  Ferrocenium salts mediate para-tert-butylcalixarene synthesis

  摘要：

  二茂铁盐在温和的非刘易斯或布氏酸性反应条件下，介导了对叔丁基钙烯烃的高产一锅式聚合合成；EPR 显示 s-三氧杂环己烷和二茂铁盐之间形成了络合物。

  DOI：

  10.1039/b813789g

文献信息

• Novolac resin-containing resist underlayer film-forming composition using bisphenol aldehyde
  申请人：NISSAN CHEMICAL INDUSTRIES, LTD.

  公开号：US10017664B2

  公开（公告）日：2018-07-10

  Resist underlayer film-forming composition for forming resist underlayer film with high dry etching resistance, wiggling resistance and exerts good flattening property and embedding property for uneven parts, including resin obtained by reacting organic compound A including aromatic ring and aldehyde B having at least two aromatic hydrocarbon ring groups having phenolic hydroxy group and having structure wherein the aromatic hydrocarbon ring groups are bonded through tertiary carbon atom. The aldehyde B may be compound of Formula (1): The obtained resin may have a unit structure of Formula (2): Ar1 and Ar2 each are C6-40 aryl group. The organic compound A including aromatic ring may be aromatic amine or phenolic hydroxy group-containing compound. The composition may contain further solvent, acid and/or acid generator, or crosslinking agent. Forming resist pattern used for semiconductor production, including forming resist underlayer film by applying the resist underlayer film-forming composition onto semiconductor substrate and baking it.

  用于形成具有高干法蚀刻抗性、抗扭曲性并具有良好的平整性和嵌入性能的抗蚀底层膜形成组合物，包括通过使含有芳香环的有机化合物A和至少具有两个含酚羟基的芳香烃环团的醛B反应而获得的树脂，并具有芳香烃环团通过三级碳原子键合的结构。醛B可以是化合物的化学式（1）： 所得的树脂可能具有化学式（2）的单元结构： Ar1和Ar2各自是C6-40芳基团。含有芳香环的有机化合物A可能是芳香胺或含酚羟基的化合物。该组合物可能进一步含有溶剂、酸和/或酸发生剂，或交联剂。用于半导体生产的形成抗蚀图案，包括通过将抗蚀底层膜形成组合物涂覆在半导体衬底上并对其进行烘烤来形成抗蚀底层膜。
• DIAMINE COMPOUND, AND HEAT-RESISTANT RESIN OR HEAT-RESISTANT RESIN PRECURSOR USING SAME
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20170334837A1

  公开（公告）日：2017-11-23

  Provided are a photosensitive resin composition which has excellent pattern processabilities (high sensitivity and high resolution) and is excellent in chemical resistance and thermal resistance after thermally treated; a heat-resistant resin or heat-resistant resin precursor used for the composition; and a diamine compound which is a raw material of the resin and the precursor. The diamine compound is a diamine compound represented by a general formula (1).

  提供了一种具有优异图案加工性（高灵敏度和高分辨率）且在热处理后具有优异化学耐性和热耐性的光敏树脂组合物；用于该组合物的耐热树脂或耐热树脂前体；以及作为树脂和前体原料的二胺化合物。该二胺化合物是由通式（1）表示的二胺化合物。
• Positive Photosensitive Insulating Resin Composition And Cured Product Thereof
  申请人：Ito Atsushi

  公开号：US20080097032A1

  公开（公告）日：2008-04-24

  Disclosed is a positive photosensitive insulating resin composition which comprises: (A) a copolymer comprising (A1) 10 to 99 mol % of a structural unit of the formula (1) and (A2) 90 to 1 mol % of a structural unit of the formula (2); (B) a quinone diazide group-containing compound; (C) at least one compound selected from the group consisting of (C1) an aromatic compound containing a methylol group and/or an alkoxy methyl group (except for aromatic compounds containing an amino group), (C2) an aromatic aldehyde compound, (C3) an aliphatic aldehyde compound, (C4) an alkyl-etherified amino group-containing compound and (C5) an epoxy group-containing compound; (D) a solvent; and (E) an adhesion assistant. Disclosed also is a cured product obtainable from the composition. wherein Ra and Rb are each an alkyl group having 1 to 4 carbon atoms, alkoxy group or aryl group, Rb and Rc are each hydrogen or a methyl group, n is an integer of 0 to 3 and m is an integer of 1 to 3. The cured product has excellent resolution, electrical insulating properties, thermal shock resistance, adhesion and other properties.

  本发明公开了一种正光敏绝缘树脂组合物，其包括：（A）共聚物，包括（A1）式（1）的结构单元的摩尔分数为10至99％和（A2）式（2）的结构单元的摩尔分数为1至90％；（B）喹喔啉二酮基含量的化合物；（C）选自以下群组中的至少一种化合物，其中（C1）含有甲醇基和/或烷氧基（除含有氨基的芳香族化合物外）的芳香族化合物，（C2）芳香醛化合物，（C3）脂肪族醛化合物，（C4）烷基醚化氨基含有化合物和（C5）环氧基含有化合物；（D）溶剂；以及（E）粘附助剂。本发明还公开了从该组合物可得到的固化产物。其中，Ra和Rb分别是具有1至4个碳原子的烷基，烷氧基或芳基，Rb和Rc分别是氢或甲基，n是0至3的整数，m是1至3的整数。该固化产物具有优异的分辨率、电绝缘性能、热冲击抗性、粘附性和其他性能。
• ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE COMPOSITION, AND RESIST FILM, RESIST-COATED MASK BLANKS, RESIST PATTERN FORMING METHOD AND PHOTOMASK EACH USING THE COMPOSITION
  申请人：FUJIFILM CORPORATION

  公开号：US20150010855A1

  公开（公告）日：2015-01-08

  There is provided an actinic ray-sensitive or radiation-sensitive composition containing (α) a compound represented by the formula (αI) capable of generating an acid having a size of 200 Å 3 or more in volume and (β) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and the formula (αI) is defined as herein, and a resist film formed using the actinic ray-sensitive or radiation-sensitive composition, a resist-coated mask blanks coated with the resist film, a resist pattern forming method comprising exposing the resist film and developing the exposed film, a photomask obtained by exposing and developing the resist-coated mask blanks, a method for manufacturing an electronic device, comprising the resist pattern forming method and an electronic device manufactured by the manufacturing method of an electronic device.

  提供一种感光或辐射敏感的组合物，其中包含(α)一种化合物，其由公式(αI)表示，能够产生大小为200Å3或更大的体积的酸，以及(β)一种化合物，能够在受到光辐射或辐射时产生酸，公式(αI)的定义如本文所述。还提供了使用该感光或辐射敏感组合物形成的光阻膜，涂有光阻膜的光阻涂层掩模坯料，包括曝光光阻膜和显影曝光后膜的光阻图案形成方法，通过曝光和显影涂有光阻涂层的掩模坯料获得的光掩模，以及一种电子器件的制造方法，包括光阻图案形成方法和制造电子器件的电子器件制造方法，以及通过该电子器件制造方法制造的电子器件。
• PHOTOSENSITIVE COMPOSITION, CURED FILM AND PRODUCTION PROCESS THEREOF, AND ELECTRONIC PART
  申请人：JSR CORPORATION

  公开号：US20140234777A1

  公开（公告）日：2014-08-21

  It is an object of the present invention to improve the curability of a resin composition and a photosensitive composition suitably employed to form e.g., a surface protecting film and an interlaminar insulating film of e.g., an electronic part, while reducing the internal stress remaining in a substrate when the composition is used to form a cured film on the substrate. The photosensitive composition includes a resin (A) having a phenolic hydroxyl group, a crosslinking agent (B1) having at least two oxazoline groups and a crosslinking agent (B2) having at least two groups represented by —CH 2 OR (wherein R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an acetyl group) and a photosensitive acid-generating agent (C).

  本发明的目的是提高树脂组合物和光敏组合物的可固化性，适用于形成电子部件的表面保护膜和层间绝缘膜等，同时在组合物用于在基板上形成固化膜时减少基板中剩余的内部应力。光敏组合物包括具有酚羟基的树脂(A)，至少具有两个噁唑烷基的交联剂(B1)，至少具有两个由—CH2OR（其中R是氢原子，具有1至10个碳原子的烷基或乙酰基）表示的基团的交联剂(B2)和光敏酸发生剂(C)。