环己基-降冰片-5-烯-2-基醚 | 100532-30-7

• 分子结构分类: 有机化合物 - 有机氧化合物
• 中文名称: 环己基-降冰片-5-烯-2-基醚
• 英文名称: 2-Cyclohexyloxy-bicyclo<2.2.1>hept-5-en
• 英文别名: cyclohexyl-norborn-5-en-2-yl ether；Cyclohexyl-norborn-5-en-2-yl-aether；5-(Cyclohexyloxy)bicyclo[2.2.1]hept-2-ene；5-cyclohexyloxybicyclo[2.2.1]hept-2-ene
• CAS: 100532-30-7
• 化学式: C₁₃H₂₀O
• 分子量: 192.301
• InChiKey: OSTARTHCSIVLSC-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.2
• 重原子数：
  14
• 可旋转键数：
  2
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.85
• 拓扑面积：
  9.2
• 氢给体数：
  0
• 氢受体数：
  1

反应信息

• 作为反应物：
  描述：

  环己基-降冰片-5-烯-2-基醚 在 platinum(IV) oxide 氢气 作用下， 以 甲醇 为溶剂， 生成 2-Cyclohexyloxy-bicyclo<2,2,1>heptan
  参考文献：
  名称：

  Vinyl compounds in diene synthesis

  摘要：

  DOI：

  10.1007/bf00909413
• 作为产物：
  描述：

  环己基乙烯醚 、 环戊二烯 生成 环己基-降冰片-5-烯-2-基醚
  参考文献：
  名称：

  Type A Behavior Pattern Today: Relevance of the JAS-S Factor to Predict Heart Rate Reactivity

  摘要：

  The authors used 89 undergraduate students' scores in the S-factor of the Jenkins Activity Survey, a measure of speed and impatience, to classify 45 participants as high scorers and 44 as low scorers. They then measured the students' tonic and phasic heart rates during an examination, a genuinely stressful situation. The experiment consisted of three phases: adaptation, task, and recovery. The findings confirmed the authors' hypothesis that the high-S scorers would show higher cardiac reactivity values than the low-S scorers. The authors also observed that the high-S scorers took more time that the low-S scorers to recover their initial heart rate values after being exposed to the stress situation. This finding led the authors to suggest that each group may have different response patterns. They call for further research on individuals with "fast activation-fast recovery" and "fast activation-slow recovery" profiles.

  DOI：

  10.1080/08964280109595769

文献信息

• RESIN MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD FOR PRODUCING RESIST UNDERLAYER FILM, AND LAYERED PRODUCT
  申请人：Mitsui Chemicals, Inc.

  公开号：EP3693793A1

  公开（公告）日：2020-08-12

  Provided is a resin material for forming an underlayer film which is used to form a resist underlayer film used in a multi-layer resist process, the resin material including a cyclic olefin polymer (I), in which a temperature at an intersection between a storage modulus (G') curve and a loss modulus (G") curve in a solid viscoelasticity of the resin material for forming an underlayer film which is as measured under conditions of a measurement temperature range of 30°C to 300°C, a heating rate of 3°C/min, and a frequency of 1 Hz in a nitrogen atmosphere in a shear mode using a rheometer is higher than or equal to 40°C and lower than or equal to 200°.

  本发明提供了一种用于形成底层膜的树脂材料，该底层膜可用于形成多层光刻胶工艺中使用的光刻胶底层膜，该树脂材料包括环烯烃聚合物 (I)、其中，用于形成底层膜的树脂材料的固体粘弹性中的存储模量（G'）曲线和损失模量（G"）曲线的交点温度高于或等于 40°C，且低于或等于 200°C；该固体粘弹性是在测量温度范围为 30°C 至 300°C、加热速率为 3°C/min 和频率为 1 Hz 的条件下，在氮气环境中使用流变仪以剪切模式测得的。
• RESIN MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD OF PRODUCING RESIST UNDERLAYER FILM, AND LAMINATE
  申请人：MITSUI CHEMICALS, INC.

  公开号：US20200241419A1

  公开（公告）日：2020-07-30

  Provided is a resin material for forming an underlayer film which is used to form a resist underlayer film used in a multi-layer resist process, the resin material including a cyclic olefin polymer (I), in which a temperature at an intersection between a storage modulus (G′) curve and a loss modulus (G″) curve in a solid viscoelasticity of the resin material for forming an underlayer film which is as measured under conditions of a measurement temperature range of 30° C. to 300° C., a heating rate of 3° C./min, and a frequency of 1 Hz in a nitrogen atmosphere in a shear mode using a rheometer is higher than or equal to 40° C. and lower than or equal to 200°.
• MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD OF PRODUCING RESIST UNDERLAYER FILM, AND LAMINATE
  申请人：MITSUI CHEMICALS, INC.

  公开号：US20200264511A1

  公开（公告）日：2020-08-20

  A material for forming an underlayer film according to the present invention is a material for forming an underlayer film which is used to form a resist underlayer film used in a multi-layer resist process, the material including a cyclic olefin polymer which has a repeating structural unit [A] represented by Formula (1) and a repeating structural unit [B] represented by Formula (2), in which a molar ratio [A]/[B] of the structural unit [A] to the structural unit [B] in the cyclic olefin polymer is greater than or equal to 5/95 and less than or equal to 95/5.