Copper;ethene | 60241-41-0

• 分子结构分类: 有机化合物 - 碳氢化合物 - 不饱和烃
• 英文名称: Copper;ethene
• CAS: 60241-41-0
• 化学式: C₄H₈Cu
• 分子量: 119.654
• InChiKey: INXWWYSQZHNIAJ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  None
• 重原子数：
  None
• 可旋转键数：
  None
• 环数：
  None
• sp3杂化的碳原子比例：
  None
• 拓扑面积：
  None
• 氢给体数：
  None
• 氢受体数：
  None

反应信息

• 作为产物：
  描述：

  乙烯 、 铜 以 gaseous matrix 为溶剂， 生成 Copper;ethene
  参考文献：
  名称：

  铜原子的气相反应：形成二羰基铜，双（乙炔）铜和双（乙烯）铜

  摘要：

  A laser photolysis-laser fluorescence technique is used to investigate reactions of ground-state copper atoms with carbon monoxide, acetylene, and ethylene at 295 and 325 K in Ar buffer gas at total pressures in the range 50-600 Torr. Kinetic studies show that a sequential addition of at least two ligand molecules per copper atom occurs in all cases. The monoligand complexes are thermally unstable at 295 K and either redissociate or add a second ligand molecule to form stable diligand complexes. A simple kinetic model is used that allows the dissociation energies of the monoligand complexes to be estimated. We find DELTA-E-degrees-0 in the range 25 +/- 5 kJ mol-1 for all complexes. The analysis also provides estimates of strong-collision, low-pressure association rate constants for the first ligand addition reactions. Simplified unimolecular rate calculations using molecular constants from previous experimental and theoretical studies show that the experimentally determined rate constants and dissociation energies are mutually consistent.

  DOI：

  10.1021/j100175a055