申请人:NAN YA PLASTICS CORP.
公开号:EP2284004A1
公开(公告)日:2011-02-16
The present invention provides a new epoxy resin which is modified with halide and oxazolidone ring. This epoxy resin can improve the peeling strength, Tg, heat resistance, and flame resistance for CCL and be used for print circuit board. The composition comprising (A) a halogen-containing epoxy which containing a oxazolidone ring, about 5∼95wt% of total weight, (B) epoxy resins with two or above epoxy groups, about 95∼5 wt% of total weight, (C) a curing agent, example of phenol novolac, and (D) a curing accelerator. After laminating the prepreg which had been made by impregnation of the mentioned composition at 170∼210°C with 10∼30kgf/cm2, the electric circuit board composition with excellent properties can be obtained. This epoxy resin composition in this invention can achieve the peeling strength>10Ibf/inch, glass transition temperature>155°C, water absorption<0.2, outstanding heat resistance and pass the UL94 V-0 flame resistance test. That can be applied to high performance electronic materials widely.
本发明提供了一种用卤化物和噁唑烷酮环改性的新型环氧树脂。这种环氧树脂可以提高 CCL 的剥离强度、Tg、耐热性和阻燃性,并可用于印刷电路板。该组合物包括(A)含唑酮环的含卤环氧树脂,约占总重量的 5∼95wt%;(B)含两个或两个以上环氧基团的环氧树脂,约占总重量的 95∼5wt%;(C)固化剂,例如苯酚酚醛;以及(D)固化促进剂。在 170∼210°C 的温度和 10∼30kgf/cm2 的压力下,将上述组合物浸渍制成的预浸料层压后,就可以得到性能优异的电路板组合物。本发明中的环氧树脂组合物可以达到剥离强度>10Ibf/inch,玻璃化温度>155°C,吸水率<0.2,耐热性能突出,并通过了 UL94 V-0 阻燃测试。可广泛应用于高性能电子材料。