3-[5-[3,5-Bis[3-(3-hydroxyphenyl)-1,2,4-oxadiazol-5-yl]phenyl]-1,2,4-oxadiazol-3-yl]phenol | 880874-41-9

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 唑类
• 英文名称: 3-[5-[3,5-Bis[3-(3-hydroxyphenyl)-1,2,4-oxadiazol-5-yl]phenyl]-1,2,4-oxadiazol-3-yl]phenol
• CAS: 880874-41-9
• 化学式: C₃₀H₁₈N₆O₆
• 分子量: 558.51
• InChiKey: XETZBBFLLJHSMN-UHFFFAOYSA-N

物化性质

• 沸点：
  910.2±75.0 °C(Predicted)
• 密度：
  1.453±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  5.5
• 重原子数：
  42
• 可旋转键数：
  6
• 环数：
  7.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  177
• 氢给体数：
  3
• 氢受体数：
  12

反应信息

• 作为反应物：
  描述：

  3-[5-[3,5-Bis[3-(3-hydroxyphenyl)-1,2,4-oxadiazol-5-yl]phenyl]-1,2,4-oxadiazol-3-yl]phenol 、 2-溴乙基丙烯酸酯 在 potassium carbonate 作用下， 以 N,N-二甲基甲酰胺 为溶剂， 反应 5.0h， 生成
  参考文献：
  名称：

  WO2006/98489

  摘要：

  公开号：
• 作为产物：
  描述：

  5-[3,5-Bis[3-(3-hexoxyphenyl)-1,2,4-oxadiazol-5-yl]phenyl]-3-(3-hexoxyphenyl)-1,2,4-oxadiazole 在 三溴化硼 、 水 作用下， 以 二氯甲烷 为溶剂， 反应 8.0h， 生成 3-[5-[3,5-Bis[3-(3-hydroxyphenyl)-1,2,4-oxadiazol-5-yl]phenyl]-1,2,4-oxadiazol-3-yl]phenol
  参考文献：
  名称：

  WO2006/98489

  摘要：

  公开号：

文献信息

• Resin composition containing surface-modified inorganic substance, thermally conductive material, and device
  申请人：FUJIFILM Corporation

  公开号：US10752778B2

  公开（公告）日：2020-08-25

  According to the present invention, there are provided a resin composition containing a surface-modified inorganic substance, which is obtained by performing surface modification on an inorganic nitride or an inorganic oxide by using a boronic acid compound, and an epoxy compound, a thermally conductive material including a cured substance of the resin composition, and a device including the thermally conductive material. The boronic acid compound has, for example, an amino group, a thiol group, a hydroxyl group, an isocyanate group, a carboxyl group, or a carboxylic acid anhydride group. By using the resin composition of the present invention, it is possible to provide a thermally conductive material having excellent thermal conductivity and a device having high durability.

  根据本发明，提供了一种含有表面改性无机物的树脂组合物，该无机物是通过使用硼酸化合物和环氧化合物对无机氮化物或无机氧化物进行表面改性而得到的；还提供了一种包括该树脂组合物固化物的导热材料，以及一种包括该导热材料的装置。硼酸化合物具有例如氨基、硫醇基、羟基、异氰酸酯基、羧基或羧酸酐基。通过使用本发明的树脂组合物，可以提供一种具有优异导热性能的导热材料和一种具有高耐用性的设备。
• Thermally conductive material, resin composition, and device
  申请人：FUJIFILM Corporation

  公开号：US10774212B2

  公开（公告）日：2020-09-15

  The present invention provides a thermally conductive material containing a disk-like compound as a thermally conductive material having high thermal conductivity and high heat resistance. For example, the present invention provides a thermally conductive material containing a cured substance of a resin composition containing a disk-like compound having two or more functional groups, in which the functional groups are selected from the group consisting of a (meth)acryl group, a (meth)acrylamide group, an oxiranyl group, an oxetanyl group, a hydroxyl group, an amino group, a thiol group, an isocyanate group, a carboxyl group, and a carboxylic acid anhydride group. The present invention also provides a device, which includes the aforementioned thermally conductive material, and the aforementioned resin composition.

  本发明提供了一种含有盘状化合物的导热材料，作为导热材料具有高导热性和高耐热性。例如，本发明提供了一种导热材料，其含有一种树脂组合物的固化物，该树脂组合物含有具有两个或两个以上官能团的盘状化合物，其中官能团选自(甲基)丙烯酰基、(甲基)丙烯酰胺基、环氧丙烷基、环氧乙烷基、羟基、氨基、硫醇基、异氰酸酯基、羧基和羧酸酐基组成的组。本发明还提供了一种装置，其中包括上述导热材料和上述树脂组合物。
• COMPOUND, COMPOSITION, RETARDATION PLATE, ELLIPTICALLY-POLARIZING PLATE AND LIQUID-CRYSTAL DISPLAY DEVICE
  申请人：Tanaka Satoshi

  公开号：US20090233009A1

  公开（公告）日：2009-09-17

  A compound useful for fabrication of retardation plates, which is represented by the formula (DI): wherein Y 11 to Y 13 represent methine or nitrogen; R 11 to R 13 represent a group of the formula (DI-A) below or others: wherein A 11 to A 16 represent methine or nitrogen; X 1 represents oxygen, sulfur, methylene or imino; L 11 represents —O—, —C(═O)—, —O—CO—, —CO—O—, —O—CO—O—, —S—, —NH—, —SO 2 —, —CH 2 —, —CH═CH—, or —C≡C—; L 12 represents a divalent linking group; Q 11 represents polymerizable group or hydrogen.
• US7968156B2
  申请人：——

  公开号：US7968156B2

  公开（公告）日：2011-06-28