PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
申请人:HITACHI CHEMICAL COMPANY, LTD.
公开号:US20150293443A1
公开(公告)日:2015-10-15
The invention provides a photosensitive resin that includes: a binder polymer that has a structural unit derived from (meth)acrylic acid, a structural unit derived from styrene or α-methyl styrene, and a structural unit derived from benzyl (meth)acrylate; a photopolymerizable compound including a first bisphenol di(meth)acrylate that has an ethyleneoxy group and a propyleneoxy group, in which a number of structural units of the ethyleneoxy group is from 1 to 20 and a number of structural units of the propyleneoxy group is from 2 to 7, and in which a total number of structural units of the ethyleneoxy group and the propyleneoxy group is more than 10; and a photopolymerization initiator.