Phenol-heterocyclic ligands, metal complexes, and their uses as catalysts
申请人:Leclerc K. Margarete
公开号:US20060135713A1
公开(公告)日:2006-06-22
Ligands, compositions, and metal-ligand complexes that incorporate phenol-heterocyclic compounds are disclosed that are useful in the catalysis of transformations such as the polymerization of monomers into polymers. The catalysts have high performance characteristics, including high comonomer incorporation into ethylene/olefin copolymers, where such olefins are for example, 1-octene, propylene or styrene. The catalysts particularly polymerize styrene to form polystyrene.
PHENOL-HETEROCYCLIC LIGANDS, METAL COMPLEXES, AND THEIR USES AS CATALYSTS
申请人:Leclerc Margarete K.
公开号:US20100048841A1
公开(公告)日:2010-02-25
Ligands, compositions, and metal-ligand complexes that incorporate phenol-heterocyclic compounds are disclosed that are useful in the catalysis of transformations such as the polymerization of monomers into polymers. The catalysts have high performance characteristics, including high comonomer incorporation into ethylene/olefin copolymers, where such olefins are for example, 1-octene, propylene or styrene. The catalysts particularly polymerize styrene to form polystyrene.
Record material of the type in which the colour forming reaction is between an electron donating chromogenic material and an electron accepting colour developer uses one or more oximes as the colour developer. Preferred oximes are monoximes, especially salicylaldoxime and its ring substituted derivatives, and dioximes such as dimethylglyoxime and mioxime.
This disclosure relates to a process for stripping an organic film on a patterned semiconductor substrate. The process includes treating the organic film with an aqueous stripper composition to remove the organic film in one step. The organic film includes at least a first layer and a second layer, the first layer has a dissolution rate of at most about 0.01μ/min in a developer at 25° C., and the second layer has a dissolution rate of greater than about 0.01μ/min in the developer at 25° C.
This disclosure relates to a composition (e.g., a cleaning and/or stripping composition) containing (a) 0.5-25 percent by weight an alkaline compound; (b) 1-25 percent by weight an alcohol amine compound; (c) 0.1-20 percent by weight a hydroxylammonium compound; (d) 5-95 percent by weight an organic solvent; (e) 0.1-5 percent by weight a corrosion inhibitor compound; and (f) 2-25 percent by weight water.