申请人:CIBA-GEIGY AG
公开号:EP0326516A2
公开(公告)日:1989-08-02
A method of making a metallic pattern on a substrate having a surface comprising bare metal in predetermined areas and metal coated by a resist in remaining areas comprises
(i) protecting the bare metal by electrodepositing thereon a heat-curable polymeric film having (a) a group which is reactive with an isocyanate group and (b) a blocked isocyanate group,
(ii) heating the electrodeposited polymeric film to render it resistant to a solvent with which the resist is removable,
(iii) removing the resist from said remaining areas using a solvent which does not remove the electrodeposited polymeric film, thereby exposing metal in said remaining areas, and
(iv) etching the metal exposed in step (iii) using an etchant which does not remove the electrodeposited polymeric film, thereby leaving a metallic pattern protected by the electrodeposited polymeric film, which can be removed subsequently using a solvent therefor.
The method is useful in the production of printed circuits.
一种在基底上制作金属图案的方法,该基底的表面包括预定区域的裸金属和剩余区域的抗蚀剂涂层金属,该方法包括
(i) 在裸金属上电沉积一层热固化聚合膜以保护裸金属,该聚合膜具有 (a) 与异氰酸酯基团反应的基团和 (b) 被阻断的异氰酸酯基团、
(ii) 加热电沉积的聚合物薄膜,使其能够耐受可去除抗蚀剂的溶剂、
(iii) 使用不去除电沉积聚合物薄膜的溶剂去除所述剩余区域的抗蚀剂,从而在所述剩余区域暴露金属,以及
(iv) 使用不去除电沉积聚合物薄膜的蚀刻剂蚀刻步骤(iii)中暴露的金属,从而留下受电沉积聚合物薄膜保护的金属图案,随后可使用溶剂将其去除。
该方法适用于印刷电路的生产。