2-Hydroxy-zimtsaeure-piperidid | 30982-48-0

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 肉桂酸及其衍生物
• 英文名称: 2-Hydroxy-zimtsaeure-piperidid
• 英文别名: 1-[3-(2-hydroxy-phenyl)-acryloyl]-piperidine；3-(2-Hydroxyphenyl)-1-(1-piperidinyl)-2-propen-1-one；3-(2-hydroxyphenyl)-1-piperidin-1-ylprop-2-en-1-one
• CAS: 30982-48-0
• 化学式: C₁₄H₁₇NO₂
• 分子量: 231.294
• InChiKey: HFROTQKOFJESPY-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.4
• 重原子数：
  17
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.36
• 拓扑面积：
  40.5
• 氢给体数：
  1
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  哌啶 、 香豆素-3-羧酸 以70%的产率得到2-Hydroxy-zimtsaeure-piperidid
  参考文献：
  名称：

  一些香豆素和4,6-二芳基-2 H-吡喃衍生物与仲胺的反应

  摘要：

  哌啶，吗啉，哌嗪或二甲胺与几种香豆素，3-溴香豆素，4,6-二芳基-2 H-吡喃-2-酮和3-溴-4,6-二芳基-2 H-硫代吡喃-2-的反应分别得到邻羟基肉桂酰胺，苯并呋喃，开链δ-氧代酰胺和噻吩衍生物。

  DOI：

  10.1002/jhet.5570180122

文献信息

• THIOL COMPOUNDS, SYNTHESIS METHOD THEREFOR, AND UTILIZATION OF SAID THIOL COMPOUNDS
  申请人：SHIKOKU CHEMICALS CORPORATION

  公开号：US20200369606A1

  公开（公告）日：2020-11-26

  The purpose of the present invention is to provide: novel thiol compounds; a method for synthesizing said thiol compounds; curing agents containing said thiol compounds; resin compositions containing said thiol compounds and an epoxy compound; and resin compositions containing said thiol compounds and an ene compound having a carbon-carbon double bond in a molecule. Furthermore, the purpose of the present invention is to provide adhesives and sealants having these resin compositions as ingredients. The thiol compounds of the present invention are represented by chemical formula (I) to chemical formula (VII).

  本发明的目的是提供：新型硫醇化合物；合成该硫醇化合物的方法；含有该硫醇化合物的固化剂；含有该硫醇化合物和环氧化合物的树脂组合物；以及含有该硫醇化合物和分子中含有碳碳双键的烯烃化合物的树脂组合物。此外，本发明的目的是提供将这些树脂组合物作为成分的粘合剂和密封剂。本发明的硫醇化合物由化学式(I)到化学式(VII)表示。
• Compound, Photopolymerization Initiator Containing Said Compound, and Photosensitive Resin Composition Containing Said Photopolymerization Initiator
  申请人：Nippon Kayaku Kabushiki Kaisha

  公开号：US20200392079A1

  公开（公告）日：2020-12-17

  This compound which has excellent solvent solubility and compatibility with a resin, and which can generate bases and radicals with high efficiency by being irradiated with active energy rays, is represented by formula (1), where, in formula (1), R 1 , R 2 , R 3 , R 5 and R 6 represent a hydroxy group or an alkoxy group; the R 4 's independently represent an organic group containing a thioether bond; R 7 and R 9 independently represent a hydrogen atom or an alkyl group with 1 to 4 carbons; R 8 represents an alkylene group or an arylene group; and X represents an oxygen atom or a sulfur atom. A photopolymerization initiator can include said novel compound; and a photosensitive resin composition can include said photopolymerization initiator, from which a cured product can be obtained that has high sensitivity and no metal corrosion.

  这种化合物具有优异的溶剂溶解性和与树脂的兼容性，可以通过受到活性能量辐射而高效地产生碱基和自由基。该化合物由公式（1）表示，其中在公式（1）中，R1、R2、R3、R5和R6代表羟基或烷氧基；R4分别表示含硫醚键的有机基团；R7和R9分别代表氢原子或1至4个碳的烷基基团；R8代表烷基或芳基；X代表氧原子或硫原子。一种光聚合引发剂可以包括上述新化合物；一种光敏树脂组合物可以包括上述光聚合引发剂，从中可以得到高灵敏度且无金属腐蚀的固化产物。
• NOVEL COMPOUND, PHOTOPOLYMERIZATION INITIATOR COMPRISING SAID COMPOUND, AND PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAID PHOTOPOLYMERIZATION INITIATOR
  申请人：TOKYO UNIVERSITY OF SCIENCE FOUNDATION

  公开号：US20180370908A1

  公开（公告）日：2018-12-27

  The purpose of the present invention is to provide: a novel compound which can generate a base and radical upon the irradiation with an active energy ray; a photopolymerization initiator which comprises the novel compound; and a photosensitive resin composition which contains the photopolymerization initiator, has high sensitivity and excellent storage stability, and can be formed into a cured article that does not have a metal-corrosive property. The novel compound is represented by formula (1): (wherein R 1 to R 6 independently represent a hydrogen atom, a hydroxy group, an alkoxy group, an organic group other than the aforementioned substituents, or the like; X represents a residue having a structure such that n hydrogen atoms are removed from a saturated hydrocarbon containing a ring structure; and n represents an integer of 1 to 6).

  本发明的目的是提供一种新的化合物，该化合物可以在受到活性能量射线照射时产生碱和自由基；一种包含该新化合物的光聚合引发剂；以及一种含有光聚合引发剂的光敏树脂组合物，该组合物具有高灵敏度和良好的储存稳定性，并且可以形成不具有金属腐蚀性的固化物品。该新化合物由式（1）表示：（其中，R1至R6独立地表示氢原子、羟基、烷氧基、除上述取代基外的有机基团等；X表示从含有环结构的饱和碳氢化合物中去除n个氢原子后的结构残基；n表示1至6的整数）。
• CURABLE COMPOSITION, CURED COATING FILM USING SAME, AND PRINTED WIRING BOARD
  申请人：Taiyo Ink Mfg. Co., Ltd.

  公开号：EP3067374A1

  公开（公告）日：2016-09-14

  Provided are: a curable composition that shows good adhesion on a printed wiring board, particularly a flexible substrate or the like, and has a high hardness; a resist coating film of the curable composition; and a printed wiring board having a resist pattern of the resist coating film. The curable composition comprises: (A) a photobase generator; (B-1) an epoxy group-containing (meth)acrylate compound or (B-2) a carboxyl group-containing (meth)acrylate compound; (C) a photopolymerization initiator; and (D-1) a thermosetting component (excluding the (B-1) epoxy group-containing (meth)acrylate compound) or (D-2) a thermosetting component (excluding the (B-2) carboxyl group-containing (meth)acrylate compound).

  本文提供了：一种在印刷线路板（尤其是柔性基板或类似材料）上显示出良好附着性并具有高硬度的可固化组合物；该可固化组合物的抗蚀涂膜；以及具有该抗蚀涂膜的抗蚀图案的印刷线路板。可固化组合物包括：(A) 光基发生器；(B-1) 含环氧基的（甲基）丙烯酸酯化合物或 (B-2) 含羧基的（甲基）丙烯酸酯化合物；(C) 光聚合引发剂；以及 (D-1) 热固性成分（不包括 (B-1) 含环氧基的（甲基）丙烯酸酯化合物）或 (D-2) 热固性成分（不包括 (B-2) 含羧基的（甲基）丙烯酸酯化合物）。
• POROUS SILICONE OBJECT AND PROCESS FOR PRODUCING SAME
  申请人：Nitto Denko Corporation

  公开号：EP3239221A1

  公开（公告）日：2017-11-01

  The present invention provides, for example, a silicone porous body having a porous structure with less cracks and a high proportion of void space as well as having a strength. The silicone porous body of the present invention includes silicon compound microporous particles, wherein the silicon compound microporous particles are chemically bonded by catalysis. For example, the abrasion resistance measured with BEMCOT® is in the range from 60% to 100%, and the folding endurance measured by the MIT test is 100 times or more. The silicone porous body can be produced, for example, by forming the precursor of the silicone porous body using sol containing pulverized products of a gelled silicon compound and then chemically bonding the pulverized products contained in the precursor of the silicone porous body. The chemical bond among the pulverized products is preferably a chemical crosslinking bond among the pulverized products, for example.

  例如，本发明提供了一种硅酮多孔体，该硅酮多孔体具有裂缝少、空隙比例高以及强度高的多孔结构。本发明的硅酮多孔体包括硅化合物微孔颗粒，其中硅化合物微孔颗粒通过催化化学键合。例如，用 BEMCOT® 测量的耐磨性在 60% 到 100% 之间，用 MIT 测试测量的耐折性在 100 倍以上。硅酮多孔体的生产方法有多种，例如，使用含有胶化硅化合物粉碎产物的溶胶形成硅酮多孔体的前体，然后将硅酮多孔体前体中含有的粉碎产物进行化学键合。粉化产物之间的化学键最好是粉化产物之间的化学交联键等。