Composite film comprising low-dielectric resin and para-oriented aromatic polyamide
申请人:Sumitomo Chemical Company, Limited
公开号:EP0870795A1
公开(公告)日:1998-10-14
Provided is a composite film comprising a continuous phase of para-oriented aromatic polyamide and a phase of low-dielectric resin, said film having a dielectric constant at 1 MHz of not more than 3.2 and a linear thermal expansion coefficient at 200 to 300°C of within ±50×10-6/°C. The composite film has characteristics such as a low dielectric constant, favorable mechanical strength, homogeneous structure, light weight, and a low linear thermal expansion coefficient, and the film is useful as a base substrate for a flexible printed circuit board.
本发明提供了一种由对位芳香族聚酰胺连续相和低介电树脂相组成的复合薄膜,所述薄膜在 1 MHz 时的介电常数不超过 3.2,在 200 至 300°C 时的线性热膨胀系数在 ±50×10-6/°C 范围内。这种复合薄膜具有介电常数低、机械强度高、结构均匀、重量轻、线性热膨胀系数低等特点,可用作柔性印刷电路板的基底。