(E)-Pentadec-2-enal | 64462-00-6

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 英文名称: (E)-Pentadec-2-enal
• 英文别名: Pentadec-2-enal
• CAS: 64462-00-6
• 化学式: C₁₅H₂₈O
• 分子量: 224.387
• InChiKey: MLTULPRRIKTZBN-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.4
• 重原子数：
  16
• 可旋转键数：
  12
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.8
• 拓扑面积：
  17.1
• 氢给体数：
  0
• 氢受体数：
  1

反应信息

• 作为产物：
  描述：

  1-碘十二烷 在 四氯化钛 、 sodium hydride 、 potassium carbonate 、 copper dichloride 作用下， 以 乙二醇二甲醚 、 溶剂黄146 、 N,N-二甲基甲酰胺 为溶剂， 反应 18.0h， 生成 (E)-Pentadec-2-enal
  参考文献：
  名称：

  一种合成α，β-不饱和醛3-甲硫基-2-丙烯基对甲苯基砜的有效试剂

  摘要：

  3-甲硫基-2-丙烯基对甲苯基砜（1）与烷基卤和碱（NaH或KOH-TOMAC）的烷基在磺酰基的α位发生烷基化反应，任选生成单烷基或二烷基化产物（ 2或3），其通过TiCl 4辅助水解分别转化为β-单取代或β，β-二取代的α，β-不饱和醛（6或7），然后除去对甲苯亚磺酸。

  DOI：

  10.1016/s0040-4039(01)81259-4

文献信息

• METHYLKETONE SYNTHASE, PRODUCTION OF METHYLKETONES IN PLANTS AND BACTERIA
  申请人：Pichersky Eran

  公开号：US20110289632A1

  公开（公告）日：2011-11-24

  Isolated genes and amino acid sequences encode methylketone synthase 2 (MKS2) enzymes from tomato plants, including, ShMKS2 and SlMKS2. When expressed recombinantly in bacteria and other host cells, the MKS2 enzymes produce methylketones of various carbon chain lengths ranging from C 7 to C 20 from 3-ketoacyl intermediate substrates. Methylketones are known to have important roles in protecting plants against pests, and also as flavor compounds, and can be used as stockfeed in the chemical industry.

  孤立的基因和氨基酸序列编码了来自番茄植物的甲基酮合酶2（MKS2）酶，包括ShMKS2和SlMKS2。当在细菌和其他宿主细胞中重组表达MKS2酶时，这些酶会从3-酮酰中间体底物产生碳链长度从C7到C20的各种甲基酮。甲基酮已知在保护植物免受害虫的作用中起重要作用，也作为风味化合物，并可用作化工业的饲料。
• Polyester-flexible polymer block copolymers and mixtures thereof
  申请人：GENCORP INC.

  公开号：EP0612786A1

  公开（公告）日：1994-08-31

  A block copolymer of generally an AB, ABA, or A(BA)n structure, or mixtures thereof where the A block is an unsaturated polyester, the B block is a flexible polymer having a Tg of 0oC or lower, and n is 2 to 5. The various block components are generally first separately prepared as polymers with the flexible polymer generally having 1 or 2 functional end groups such as an amine group, a carboxyl group, or a hydroxyl group with the later being preferred. Alternatively, for low molecular weight unsaturated polyester blocks, the block can be made in situ. The preferred reaction route is to react a mono or dihydroxy terminated flexible polymer with a diisocyanate which subsequently can be readily reacted with the polyester. The block copolymers can be utilized as toughening agents. They furthermore can be utilized to coat a fiber structure such as individual fibers, a woven structure, or a nonwoven structure such as mats, rovings, bundles, and the like, with the coated fiber structures subsequently incorporated into a polymeric matrix such as polyester.

  一般为 AB、ABA 或 A(BA)n 结构的嵌段共聚物或其混合物，其中 A 嵌段为不饱和聚酯，B 嵌段为 Tg 为 0oC 或更低的柔性聚合物，n 为 2 至 5。各种嵌段组分一般首先分别制备成聚合物，柔性聚合物一般具有 1 或 2 个官能团，如胺基、羧基或羟基，以羟基为佳。另外，对于低分子量的不饱和聚酯嵌段，也可以就地制造。首选的反应路线是将单羟基或二羟基端基柔性聚合物与二异氰酸酯反应，二异氰酸酯随后很容易与聚酯反应。嵌段共聚物可用作增韧剂。此外，它们还可用于涂覆纤维结构，如单根纤维、编织结构或非编织结构，如毡、粗纱、纤维束等，涂覆的纤维结构随后可与聚酯等聚合物基体结合。
• Polyester-flexible polymer block copolymer coated fiber structures and utilization thereof in a polymer matrix
  申请人：GENCORP INC.

  公开号：EP0612787A1

  公开（公告）日：1994-08-31

  A composite material having a coated fiber structure dispersed in a polyester matrix. The coating is a block copolymer having an elastomer block bonded to an ester block. The coating provides a flexible barrier between the fiber structure and the polyester matrix which results in a strong fiber reinforced composite having better crack resistance and improved toughness. The composite is particularly suited for use as a molding compound for use in the production of automotive body panels and structural components, aircraft components, sporting goods, housings for electrical and various other consumer goods, etc.

  一种复合材料，具有分散在聚酯基体中的涂层纤维结构。涂层是一种嵌段共聚物，其中的弹性体嵌段与酯嵌段结合在一起。涂层在纤维结构和聚酯基体之间提供了一个柔性屏障，使纤维增强复合材料具有更强的抗裂性和韧性。这种复合材料特别适合用作模塑化合物，用于生产汽车车身面板和结构部件、飞机部件、体育用品、电器外壳和其他各种消费品等。
• Interface adhesive
  申请人：Lord Corporation

  公开号：US20040000712A1

  公开（公告）日：2004-01-01

  The invention is directed thermal interfaced die assemblies and 1-component, 96-100% solids, thermosetting, silver-filled thermal interface based on epoxy resins useful for integrated circuit packages enabling conducting heat generated by the die. The adhesive is placed between the die and lid, lid and heat sink and/or die and the heat sink. The interface adhesive composition comprises an inorganic component and an organic component. The inorganic component comprising thermally conductive filler is present at from 70% 85% by weight, and organic component comprises from 60 to 70 wt. % of a diglycidal ether of a bis-phenol compound, 4 to 30 wt. % of an acyclic aliphatic or cycloaliphatic or mononuclear aromatic diglycidal ether, 3 to 30% of a monofunctional epoxy compound, and 20-30% of a polyamine anhydride adduct.

  本发明是针对热界面裸片组件和单组分、96-100%固含量、热固性、基于环氧树脂的银填充热界面，适用于能够传导裸片产生的热量的集成电路封装。粘合剂置于芯片与盖子、盖子与散热器和/或芯片与散热器之间。界面粘合剂组合物包括无机成分和有机成分。无机成分包括导热填料，重量百分比为 70% 至 85%，有机成分包括 60% 至 70% 的双酚化合物二缩醚、4% 至 30% 的无环脂族或环脂族或单核芳香族二缩醚、3% 至 30% 的单官能环氧化合物和 20% 至 30% 的多胺酸酐加合物。
• 3-Oxiranyl benzoic acids and derivatives thereof
  申请人：G.D. Searle & Co.

  公开号：EP0360246B1

  公开（公告）日：1994-03-30