3-methyl-1,5-pentanediol divinyl ether | 66055-69-4

• 分子结构分类: 有机化合物 - 有机氧化合物
• 英文名称: 3-methyl-1,5-pentanediol divinyl ether
• 英文别名: 1,5-Bis(ethenyloxy)-3-methylpentane；1,5-bis(ethenoxy)-3-methylpentane
• CAS: 66055-69-4
• 化学式: C₁₀H₁₈O₂
• 分子量: 170.252
• InChiKey: RJPKVNRKKZUKNN-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.9
• 重原子数：
  12
• 可旋转键数：
  8
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.6
• 拓扑面积：
  18.5
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  3-甲基-1,5-戊二醇 、 乙炔 在 potassium hydroxide 作用下， 以 neat (no solvent) 为溶剂， 110.0~155.0 ℃ 、30.0 kPa 条件下， 反应 16.5h， 以70%的产率得到3-methyl-1,5-pentanediol divinyl ether
  参考文献：
  名称：

  METHOD FOR PRODUCING DIVINYL ETHER COMPOUND HAVING ALKYLENE SKELETON

  摘要：

  一种方法可以以快速的生产速率和高反应产率，从脂二醇和乙炔中产生一种具有烷烯骨架的双乙烯醚化合物。在生产方法中，可以在碱金属催化剂存在下，使具有4至20个碳原子的烷烯基团的化合物（式1）与乙炔发生反应，从而产生一种具有式（2）的化合物，并且反应可以在无溶剂的情况下进行。

  公开号：

  US20220033335A1

文献信息

• Photopolymerization initiator composition and photopolymerizable composition
  申请人：TOYO INK MANUFACTURING CO., LTD.

  公开号：EP0690074B1

  公开（公告）日：1998-09-02
• ACTIVE RESIN COMPOSITION, SURFACE MOUNTING METHOD AND PRINTED WIRING BOARD
  申请人：KITAMURA Kazunori

  公开号：US20120168219A1

  公开（公告）日：2012-07-05

  A surface mounting method includes applying an active resin composition to at least part of a surface of a printed wiring substrate; mounting a surface mount device on the substrate; performing reflow soldering; applying an under-filling resin into a space of interest; before and/or after applying the under-filling resin, performing a vacuum treatment and/or heating at a temperature lower than the curing reaction-initiating temperature of any of the applied active resin composition and the under-filling resin; and subsequently, thermally curing the resin composition and the under-filling resin. The active resin composition contains an epoxy resin in an amount of 100 parts by weight, a blocked carboxylic acid compound in an amount of 1-50 parts by weight and/or a carboxylic acid compound in an amount of 1-10 parts by weight, and a curing agent which can initiate curing reaction at 150° C. or higher, in an amount of 1-30 parts by weight.
• SURFACE MOUNTING METHOD UTILIZING ACTIVE RESIN COMPOSITION
  申请人：SAN-EI KAGAKU CO., LTD.

  公开号：US20150158103A1

  公开（公告）日：2015-06-11

  A surface mounting method includes applying an active resin composition to at least part of a surface of a printed wiring substrate; mounting a surface mount device on the substrate; performing reflow soldering; applying an under-filling resin into a space of interest; before and/or after applying the under-filling resin, performing a vacuum treatment and/or heating at a temperature lower than the curing reaction-initiating temperature of any of the applied active resin composition and the under-filling resin; and subsequently, thermally curing the resin composition and the under-filling resin. The active resin composition contains an epoxy resin in an amount of 100 parts by weight, a blocked carboxylic acid compound in an amount of 1-50 parts by weight and/or a carboxylic acid compound in an amount of 1-10 parts by weight, and a curing agent which can initiate curing reaction at 150° C. or higher, in an amount of 1-30 parts by weight.
• US4134813A
  申请人：——

  公开号：US4134813A

  公开（公告）日：1979-01-16
• US5631307A
  申请人：——

  公开号：US5631307A

  公开（公告）日：1997-05-20