L-glycero-D-galacto-heptose | 22617-40-9

• 分子结构分类: 有机化合物 - 有机氧化合物
• 英文名称: L-glycero-D-galacto-heptose
• 英文别名: L_r-2t_F,3c_F,4c_F,5t_F,6r_F,7-Hexahydroxy-heptanal；(2R,3S,4S,5R,6S)-2,3,4,5,6,7-Hexahydroxyheptanal；(2R,3S,4S,5R,6S)-2,3,4,5,6,7-hexahydroxyheptanal
• CAS: 22617-40-9
• 化学式: C₇H₁₄O₇
• 分子量: 210.184
• InChiKey: YPZMPEPLWKRVLD-PAMBMQIZSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -3.6
• 重原子数：
  14
• 可旋转键数：
  6
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.86
• 拓扑面积：
  138
• 氢给体数：
  6
• 氢受体数：
  7

反应信息

• 作为产物：
  描述：

  alkaline earth salt of/the/ methylsulfuric acid 在 溶剂黄146 作用下， 生成 L-glycero-D-galacto-heptose
  参考文献：
  名称：

  Un nouvel heptose, le l-glycéro-d-galacto-heptose

  摘要：

  DOI：

  10.1016/s0008-6215(00)82243-0

文献信息

• SUGAR CHAIN CONTAINING 4-POSITION HALOGENATED GALACTOSE AND APPLICATION THEREOF
  申请人：Nishimura Shin-Ichiro

  公开号：US20090018327A1

  公开（公告）日：2009-01-15

  The present invention is directed to, for example, an oligosaccharide having at an end thereof a 4-position halogenated galactose residue represented by formula (I): (wherein X represents a halogen atom, and R represents a monosaccharide, an oligosaccharide, or a carrier), a transferase inhibitor containing the oligosaccharide, and a method for inhibiting sugar chain elongation reaction in the presence of glycosyltransferase, the method including employing the inhibitor. The invention also provides a method for producing a 4-position halogenated galactose sugar nucleotide represented by formula (II): (wherein each of R 1 to R 3 represents a hydroxyl group, an acetyl group, a halogen atom, or a hydrogen atom; X represents a halogen atom; and M represents a hydrogen ion or a metal ion), wherein the method employs bacterium-derived galactokinase and bacterium-derived hexose-1-phosphate uridylyltransferase. The invention is also directed to a sugar chain containing 4-position halogenated galactose envisaged to be employed as drugs and other materials, and to applications of the compound.

  本发明涉及一种寡糖，其末端具有由公式(I)表示的4位卤代半乳糖残基：（其中X代表卤素原子，R代表单糖，寡糖或载体），含有该寡糖的转移酶抑制剂，以及在存在糖基转移酶时抑制糖链延长反应的方法，该方法包括使用该抑制剂。该发明还提供了一种生产由公式(II)表示的4位卤代半乳糖核苷酸的方法：（其中R1至R3中的每一个代表羟基、乙酰基、卤素原子或氢原子；X代表卤素原子；M代表氢离子或金属离子），该方法利用细菌来源的半乳糖激酶和细菌来源的己糖-1-磷酸尿苷转移酶。本发明还涉及一种含有4位卤代半乳糖的糖链，可用作药物和其他材料，并涉及该化合物的应用。
• FOUNTAIN SOLUTION COMPOSITION FOR LITHOGRAPHIC PRINTING AND HEAT-SET OFFSET ROTARY PRINTING PROCESS
  申请人：HAIJIMA Akitmitsu

  公开号：US20090226616A1

  公开（公告）日：2009-09-10

  A fountain solution composition for lithographic printing characterized by comprising at least one acyclic hydrocarbon diol compound, having 9 carbon atoms in total and two —OH groups, wherein the number of carbon atoms existing between said two —OH groups via minimal distance is from 2 to 6, and at least one cationic compound represented by a specific formula.

  一种用于平版印刷的泉水液组合物，其特征在于包括至少一种无环烃二醇化合物，总共有9个碳原子和两个-OH基团，其中存在于这两个-OH基团之间的碳原子数量的最小距离为2到6，并且至少包括一个由特定公式表示的阳离子化合物。
• THERMOPLASTIC POLYMER COMPOSITION AND PROCESSING STABILISER
  申请人：Kimura Yoshikazu

  公开号：US20130032756A1

  公开（公告）日：2013-02-07

  The present invention provides a thermoplastic polymer composition containing a particular phenol compound or organic phosphoric compound, compound (9) which is compound (9a) represented by C m H 2m O m wherein m is an integer of not less than 3 and not more than 10, and having one aldehyde group or ketone group and m−1 hydroxy groups with at least one hydroxy group having been replaced by an alkoxy group represented by —OR 26 wherein R 26 is a C 1-12 alkyl group, and a thermoplastic polymer, and a processing stabilizer containing a particular phenol compound or organic phosphoric compound, and compound (9). A combined use of a particular phenol compound or organic phosphoric compound and compound (9) can improve processing stability of a thermoplastic polymer composition.

  本发明提供了一种热塑性聚合物组合物，其中包含特定的酚化合物或有机磷化合物、化合物(9)，该化合物(9)表示为CmH2mOm，其中m是不小于3且不大于10的整数，具有一个醛基或酮基和m-1个羟基，其中至少一个羟基已被一个表示为—OR26的烷氧基所取代，其中R26是C1-12烷基，以及一种热塑性聚合物和一种加工稳定剂，该加工稳定剂包含特定的酚化合物或有机磷化合物和化合物(9)。特定的酚化合物或有机磷化合物和化合物(9)的联合使用可以提高热塑性聚合物组合物的加工稳定性。
• HOT MELT ADHESIVE COMPOSITION
  申请人：JSR Corporation

  公开号：EP1700896A1

  公开（公告）日：2006-09-13

  [Problem] To provide an adhesive composition which is used for fixing a semiconductor wafer or the like onto a substrate, exhibits firm adhesion with high heat resistance in the wafer grinding stage and is melted by heating to enable easy peeling after the completion of the wafer grinding stage. [Means to solve problem] The hot-melt adhesive composition of the invention is a composition containing as a main component a crystalline compound having a melting temperature of 50 to 300°C, and has a melting temperature width of not more than 30°C and a melt viscosity of not more than 0.1 Pa·s. The crystalline compound as a main component is desired to be an organic compound composed of elements of C, H and O only and having a molecular weight of not more than 1000, preferably an aliphatic compound or an alicyclic compound, particularly preferably a compound having a steroid skeleton and/or a hydroxyl group.

  [问题] 提供一种粘合剂组合物，该组合物用于将半导体晶片或类似物固定在基板上， 在晶片研磨阶段表现出牢固的粘合性和高耐热性，并且在晶片研磨阶段结束后通过加 热熔化以便于剥离。[解决问题的方法] 本发明的热熔粘合剂组合物是一种组合物，其主要成分是熔化温度为 50 至 300°C、熔化温度宽度不超过 30°C、熔化粘度不超过 0.1 Pa-s的结晶化合物。作为主要成分的结晶化合物最好是仅由 C、H 和 O 元素组成且分子量不超过 1000 的有机化合物，最好是脂肪族化合物或脂环族化合物，尤其是具有甾体骨架和/或羟基的化合物。
• Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films
  申请人：BASF SE

  公开号：EP2428541A1

  公开（公告）日：2012-03-14

  An aqueous polishing composition has been found, the said aqueous polishing composition comprising (A) at least one type of abrasive particles which are positively charged when dispersed in an aqueous medium free from component (B) and having a pH in the range of from 3 to 9 as evidenced by the electrophoretic mobility; (B) at least one water-soluble polymer selected from the group consisting of linear and branched alkylene oxide homopolymers and copolymers; and (C) at least one anionic phosphate dispersing agent; and a process for polishing substrate materials for electrical, mechanical and optical devices making use of the aqueous polishing composition.

  发现了一种水性抛光组合物，所述水性抛光组合物包括 (A) 至少一种磨料颗粒，分散在不含组分（B）的水介质中时带正电，从电泳迁移率看，其 pH 值在 3 至 9 之间； (B) 至少一种水溶性聚合物，选自由线性和支链环氧亚烷基均聚物和共聚物组成的 组；以及 (C) 至少一种阴离子磷酸盐分散剂； 以及一种利用该水性抛光组合物对电气、机械和光学设备的基底材料进行抛光的工艺。