[EN] HSP-90 BINDING COMPOUNDS, COMPOSITIONS THEREOF, AND THEIR USE I? THE TREATMENT AND PREVENTION OF FUNGAL INFECTIONS<br/>[FR] COMPOSÉS DE LIAISON À HSP-90, COMPOSITIONS DE CES COMPOSÉS, ET UTILISATIONS DE CES COMPOSÉS POUR LE TRAITEMENT ET LA PRÉVENTION D'INFECTIONS FONGIQUES
申请人:PHARMASCIENCE INC
公开号:WO2012126084A1
公开(公告)日:2012-09-27
The invention relates to therapeutic compounds that bind to HSP90. The compounds disclosed herein bind HSP90 and alter the chaperoning capability of HSP90 proteins. The invention also relates to pharmaceutical compositions comprising these compounds, and methods of treating or preventing fungal infections.
该发明涉及与HSP90结合的治疗化合物。本文披露的化合物与HSP90结合并改变HSP90蛋白的分子伴侣能力。该发明还涉及包含这些化合物的药物组合物,以及治疗或预防真菌感染的方法。