2-Hydroxycyclohexylmethacrylat | 54146-65-5

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: 2-Hydroxycyclohexylmethacrylat
• 英文别名: (3-Hydroxycyclohexyl) 2-methylprop-2-enoate
• CAS: 54146-65-5
• 化学式: C₁₀H₁₆O₃
• 分子量: 184.235
• InChiKey: MXSRIIVUIAYLTB-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.7
• 重原子数：
  13
• 可旋转键数：
  3
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.7
• 拓扑面积：
  46.5
• 氢给体数：
  1
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  甲基丙烯酸 、 氧化环己烯 在 potassium methacrylate 作用下， 以 间二甲苯 为溶剂， 生成 2-Hydroxycyclohexylmethacrylat
  参考文献：
  名称：

  Ivkina,A.V. et al., Russian Journal of Applied Chemistry, 1974, vol. 47, p. 2195 - 2196

  摘要：

  DOI：

文献信息

• IONIC POLYMERS, METHOD OF MANUFACTURE, AND USES THEREOF
  申请人：Yontz Dorie J.

  公开号：US20120118832A1

  公开（公告）日：2012-05-17

  An ionic polymer of formula VI wherein each b=0 or 1; X is hydrogen, 1/z of a metal ion of charge z, a protonated nitrogen base, or a tetrasubstituted organic ammonium compound; the molar ratio of q:r:s:t=(100-0.1):(0-99.9):(0-50):(0-30); R 1 , R 2 and R 3 are hydrogen or C 1-4 alkyl; R 4 , R 5 , R 6 and R 7 are hydrogen, C 1-4 alkyl or F, wherein F is a functional group that imparts a property to polymer VI, at least one and no more than two of R 4 , R 5 , R 6 and R 7 are F and F is the same or different; G is a single bond or a C 1-30 hydrocarbyl group; and for each instance of t when t is not zero, c=0-5 and d=0-5, provided that c+d=1-5, and wherein q, r and s as present in c are independent of any other value of q, r and s.

  化学式为VI的离子聚合物，其中每个b=0或1；X是氢、带电荷z的金属离子的1/z、质子化的氮碱基或四取代有机铵化合物；q:r:s:t的摩尔比为(100-0.1)∶(0-99.9)∶(0-50)∶(0-30)；R1、R2和R3为氢或C1-4烷基；R4、R5、R6和R7为氢、C1-4烷基或F，其中F是赋予聚合物VI某种性质的官能团，R4、R5、R6和R7中至少有一个且不超过两个为F，F相同或不同；G为单键或C1-30烃基基团；对于每个t的实例，当t不为零时，c=0-5且d=0-5，前提是c+d=1-5，且在c中出现的q、r和s与任何其他q、r和s的值是独立的。
• RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
  申请人：Sumitomo Bakelite Co., Ltd.

  公开号：EP2671925A1

  公开（公告）日：2013-12-11

  The invention provides a resin composition that is excellent in terms of coating workability and can supply reliability, including the soldering reflow resistance, to a semiconductor device when being used as a die attach material or an adhesive for a heat dissipation member. The resin composition of the invention contains a polymer or copolymer of a conjugated diene compound having at least one functional group, a thermosetting resin and a (meth)acryl polymer or copolymer having a reactive functional group that can react with other reactive groups.

  本发明提供了一种树脂组合物，该树脂组合物在用作芯片附着材料或散热部件的粘合剂时，涂层加工性优异，并能为半导体器件提供可靠性，包括耐焊接回流性。本发明的树脂组合物含有至少具有一个官能团的共轭二烯化合物的聚合物或共聚物、热固性树脂和具有可与其他反应性官能团反应的反应性官能团的（甲基）丙烯酸聚合物或共聚物。
• SURFACE-TREATED SILICA FILLER AND RESIN COMPOSITION CONTAINING SURFACE-TREATED SILICA FILLER
  申请人：Namics Corporation

  公开号：EP3564323A1

  公开（公告）日：2019-11-06

  The present invention provides a surface-treated silica filler for suppressing an increase in viscosity when added to a resin composition used for applications such as a semiconductor sealing material, and the resin composition containing the surface-treated silica filler. The surface-treated silica filler of the present invention is surface-treated with a basic substance having an acid dissociation constant (pKa) of its conjugate acid of 9.4 or more.

  本发明提供了一种经表面处理的二氧化硅填料，用于抑制添加到半导体密封材料等应用的树脂组合物中时粘度的增加，以及含有经表面处理的二氧化硅填料的树脂组合物。本发明的表面处理二氧化硅填料是用共轭酸的酸解离常数（pKa）为 9.4 或更高的碱性物质进行表面处理的。
• METHOD FOR PRODUCING SILVER PARTICLES, THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND ELECTRIC/ELECTRONIC PART
  申请人：Kyocera Corporation

  公开号：EP4023721A1

  公开（公告）日：2022-07-06

  Provided is a thermosetting resin composition containing: (A) silver particles including secondary particles having an average particle size from 0.5 to 5.0 µm, the secondary particles being formed by aggregation of primary particles having an average particle size from 10 to 100 nm; and (B) a thermosetting resin.

  本发明提供了一种热固性树脂组合物，其中含有：(A) 银粒子，包括平均粒径为 0.5 至 5.0 微米的次级粒子，次级粒子由平均粒径为 10 至 100 纳米的初级粒子聚集而成；以及 (B) 热固性树脂。
• Polymer compound, film obtained by hardening this polymer compound and electronic device comprising this film
  申请人：SUMITOMO CHEMICAL COMPANY, LIMITED

  公开号：US10676554B2

  公开（公告）日：2020-06-09

  A polymer compound comprising a repeating unit having at least one group selected from the group consisting of a blocked isocyanato group and a blocked isothiocyanato group, a repeating unit having at least one group selected from the group consisting of a hydroxy group and a carboxy group and a repeating unit represented by the following formula (1), wherein the content of the repeating unit having at least one group selected from the group consisting of a blocked isocyanato group and a blocked isothiocyanato group in the polymer compound is 1% by mol or more and 30% by mol or less when the total content of all repeating units contained in the above-described polymer compound is taken as 100% by mol: in the formula (1), R2, R2 and R3 each independently represent a hydrogen atom or a methyl group.

  一种聚合物化合物，包括 具有至少一个选自封端异氰酸酯基团和封端异硫氰酸酯基团的基团的重复单元、 具有至少一个选自羟基和羧基的基团的重复单元，以及 由下式(1)表示的重复单元，其中 具有至少一个选自封端异氰基和封端异硫氰基的基团的重复单元在聚合物化合物中的含量为 1%（以摩尔计）或以上，当上述聚合物化合物中所含所有重复单元的总含量为 100%（以摩尔计）时，其含量为 30%（以摩尔计）或以下： 在式 (1) 中，R2、R2 和 R3 各自独立地代表氢原子或甲基。