Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate
申请人:Sugasaki Atsushi
公开号:US20090220752A1
公开(公告)日:2009-09-03
The invention provides a resin composition for laser engraving, having a binder polymer containing at least one of a structure unit represented by the following Formula (I) or a structure unit represented by the following Formula (II). In the Formulae, Q represents a partial structure which provides an acid group having an acid dissociation constant pKa of 0 to 20 when it is in the form of -Q-H; R
1
to R
3
each independently represent a hydrogen atom or a monovalent organic group; and A and B each independently represent a bivalent organic connecting group. The invention further provides a relief printing plate precursor having a relief forming layer containing the resin composition, a method for manufacturing a relief printing plate having crosslinking components of the relief forming layer and laser engraving the relief forming layer, and a relief printing plate formed thereby.