Compositions containing an adhesive material, a release additive and a copper passivation agent are suitable for temporarily bonding two surfaces, such as a semiconductor substrate active side and a carrier substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate having a copper surface is desired.
含有粘合剂材料、脱模添加剂和
铜钝化剂的组合物适用于临时粘合两个表面,如半导体衬底的有源面和载体衬底。在制造电子设备时,需要将元件临时粘合到具有
铜表面的基底上,这些组合物非常有用。