Tris(carboxymethyl)isocyanurat | 1968-52-1

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: Tris(carboxymethyl)isocyanurat
• 英文别名: 2,2',2''-(2,4,6-Trioxo-1,3,5-triazinane-1,3,5-triyl)triacetic acid；2-[3,5-bis(carboxymethyl)-2,4,6-trioxo-1,3,5-triazinan-1-yl]acetic acid
• CAS: 1968-52-1
• 化学式: C₉H₉N₃O₉
• 分子量: 303.185
• InChiKey: IVCVVIRNYYSSFR-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -1.8
• 重原子数：
  21
• 可旋转键数：
  6
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.33
• 拓扑面积：
  173
• 氢给体数：
  3
• 氢受体数：
  9

反应信息

• 作为反应物：
  描述：

  Tris(carboxymethyl)isocyanurat 在 乙基三苯基溴化膦 、 potassium carbonate 、 间氯过氧苯甲酸 作用下， 以 N-甲基吡咯烷酮 、 氯仿 为溶剂， 反应 73.0h， 生成 [3-[2-[3,5-Bis[2-[2-hydroxy-3-[2-(tetrazol-1-yl)acetyl]oxypropoxy]-2-oxoethyl]-2,4,6-trioxo-1,3,5-triazinan-1-yl]acetyl]oxy-2-hydroxypropyl] 2-(tetrazol-1-yl)acetate
  参考文献：
  名称：

  TW2021/28671

  摘要：

  公开号：
• 作为产物：
  描述：

  2,2',2''-(2,4,6-trioxo-1,3,5-triazinane-1,3,5-triyl)triacetonitrile 在 盐酸 作用下， 生成 Tris(carboxymethyl)isocyanurat
  参考文献：
  名称：

  [EN] COMPOUNDS AND METHODS FOR CHELATING METALS IN AQUEOUS SOLUTIONS
  [FR] COMPOSÉS ET PROCÉDÉS DE CHÉLATION DE MÉTAUX EN SOLUTIONS AQUEUSES

  摘要：

  公开号：

  WO2010138720A9

文献信息

• COATING COMPOSITION FOR FORMING RESIST UNDERLAYER FILM FOR EUV LITHOGRAPHY PROCESS
  申请人：ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.

  公开号：US20200133126A1

  公开（公告）日：2020-04-30

  A monomer represented by Chemical Formula (1): wherein, X, Y, and Z are the same as described in the specification, and the polymer including repeat units derived from the monomer.

  一种单体，化学式表示为（1）：其中，X、Y和Z与说明书中描述的相同，且聚合物包括从该单体导出的重复单元。
• THERMOSETTING RESIN COMPOSITION FOR LIGHT REFLECTION, SUBSTRATE MADE THEREFROM FOR PHOTOSEMICONDUCTOR ELEMENT MOUNTING, PROCESS FOR PRODUCING THE SAME, AND PHOTOSEMICONDUCTOR DEVICE
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP2199339A1

  公开（公告）日：2010-06-23

  There is provided a thermosetting light-reflecting resin composition that has a high level of various characteristics required of optical semiconductor element mounting boards, such as optical properties and thermal discoloration resistance, provides high releasability during molding such as transfer molding, and allows molding processes to be performed continuously. There are also provided a highly-reliable optical semiconductor element mounting board and an optical semiconductor device each produced with the resin composition, and methods for efficient production thereof. A thermosetting light-reflecting resin composition is prepared and used, which includes (A) an epoxy resin, (B) a curing agent, (C) a curing catalyst, (D) an inorganic filler, (E) a white pigment, (F) an additive, and (G) a release agent as major components, wherein the resin composition, after curing, has a diffuse reflectance of 80% or more at a light wavelength of 400 nm; and the resin composition is possible to perform transfer molding 100 times or more continuously.

  本发明提供了一种热固性光反射树脂组合物，该组合物具有光学半导体元件安装板所需的高水平的各种特性，如光学特性和耐热变色性，在转移模塑等模塑过程中具有高脱模性，并可连续执行模塑工序。此外，还提供了使用该树脂组合物生产的高可靠性光半导体元件安装板和光半导体器件及其高效生产方法。制备并使用了一种热固性光反射树脂组合物，其主要成分包括(A)环氧树脂、(B)固化剂、(C)固化催化剂、(D)无机填料、(E)白色颜料、(F)添加剂和(G)脱模剂，其中固化后的树脂组合物在光波长为 400 纳米时的漫反射率为 80% 或以上；并且该树脂组合物可以连续进行 100 次或更多次的转移成型。
• THERMOSETTING RESIN COMPOSITION, EPOXY RESIN MOLDING MATERIAL, AND POLYVALENT CARBOXYLIC ACID CONDENSATE
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP2233507A1

  公开（公告）日：2010-09-29

  The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150°C, as measured with an ICI cone-plate Brookfield viscometer.

  本发明的环氧树脂模塑材料包括(A)环氧树脂和(B)固化剂，其中(B)固化剂含有多价羧酸缩合物。本发明的热固性树脂组合物由(A)环氧树脂和(B)固化剂组成，其中(B)固化剂的粘度在 150℃时为 1.0-1000 mPa-s，用 ICI 锥板布鲁克菲尔德粘度计测量。
• Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device
  申请人：Hitachi Chemical Co., Ltd.

  公开号：EP2540775A2

  公开（公告）日：2013-01-02

  There is provided a thermosetting light-reflecting resin composition that has a high level of various characteristics required of optical semiconductor element mounting boards, such as optical properties and thermal discoloration resistance, provides high releasability during molding such as transfer molding, and allows molding processes to be performed continuously. There are also provided a highly-reliable optical semiconductor element mounting board and an optical semiconductor device each produced with the resin composition, and methods for efficient production thereof. A thermosetting light-reflecting resin composition is prepared and used, which includes (A) an epoxy resin, (B) a curing agent, (C) a curing catalyst, (D) an inorganic filler, (E) a white pigment, (F) an additive, and (G) a release agent as major components, wherein the resin composition, after curing, has a diffuse reflectance of 80% or more at a light wavelength of 400 nm; and the resin composition is possible to perform transfer molding 100 times or more continuously.

  本发明提供了一种热固性光反射树脂组合物，该组合物具有光学半导体元件安装板所需的高水平的各种特性，如光学特性和耐热变色性，在转移模塑等模塑过程中具有高脱模性，并可连续执行模塑工序。此外，还提供了使用该树脂组合物生产的高可靠性光半导体元件安装板和光半导体器件及其高效生产方法。制备并使用了一种热固性光反射树脂组合物，其主要成分包括(A)环氧树脂、(B)固化剂、(C)固化催化剂、(D)无机填料、(E)白色颜料、(F)添加剂和(G)脱模剂，其中固化后的树脂组合物在光波长为 400 纳米时的漫反射率为 80% 或以上；并且该树脂组合物可以连续进行 100 次或更多次的转移成型。
• POLYCARBOXYLIC ACID CONDENSATE, THERMOSETTING RESIN COMPOSITION, SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT AND PROCESS FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE
  申请人：Hitachi Chemical Co., Ltd.

  公开号：EP2599815A1

  公开（公告）日：2013-06-05

  The present invention relates to a polyvalent carboxylic acid condensate in which a carboxyl group-containing compound is intramolecularly condensed, the polyvalent carboxylic acid condensate having a constituent unit derived from the carboxyl group-containing compound which has solubility in water of no greater than 100 g/L at 30°C.

  本发明涉及一种多价羧酸缩合物，其中含有羧基的化合物在分子内缩合，该多价羧酸缩合物的组成单元来自含有羧基的化合物，在 30°C 时在水中的溶解度不大于 100 克/升。