An electrodepositable composition is provided comprising: (a) active hydrogen-containing, cationic salt group-containing resin electrodepositable on a cathode; (b) at least one at least partially capped polyisocyanate curing agent; (c) at least one metal-containing catalyst; and (d) at least one material having the following general formula: ##STR1## wherein R.sub.1 is alkyl or substituted alkyl having 1 to 18 carbon atoms or aryl or substituted aryl; and R.sub.2 is hydrogen, alkyl or substituted alkyl having 1 to 18 carbon atoms or aryl or substituted aryl. The composition can demonstrate enhanced corrosion resistance at low metal catalyst levels without loss of cured film properties or appearance when electrodeposited and cured over conductive substrates.
提供一种电沉积组合物,包括:(a)在阴极上可电沉积的活性含氢、阳离子盐基含量的
树脂;(b)至少一种部分帽子化的聚
异氰酸酯固化剂;(c)至少一种含
金属催化剂;以及(d)至少一种具有以下一般式的材料:##STR1## 其中R.sub.1是具有1至18个碳原子的烷基或取代烷基,或芳基或取代芳基;而R.sub.2是氢、具有1至18个碳原子的烷基或取代烷基,或芳基或取代芳基。该组合物可以在低
金属催化剂
水平下展示出增强的耐腐蚀性,同时在导电基材上电沉积和固化时不会损失固化膜的性能或外观。