Provided is a resin capable of producing a photosensitive resin composition having high sensitivity and heat resistance. Disclosed is a resin having a structure represented by general formula (1) or (2) as a main component, wherein R2 has an organic group represented by general formula (3) and an organic group represented by general formula (4).
本发明提供了一种能够生产具有高灵敏度和耐热性的光敏
树脂组合物的
树脂。公开了一种以通式(1)或(2)表示的结构为主要成分的
树脂,其中 R2 具有通式(3)表示的有机基团和通式(4)表示的有机基团。