申请人:BASF SE
公开号:WO2018162554A1
公开(公告)日:2018-09-13
The present invention refers to a composition comprising a) from 1 to 60 wt.-%, based on the total weight of the composition, of at least one polymeric resin, and b) from 40 to 99 wt.-%, based on the total weight of the composition, of an organic solvent having a Hansen hydrogen bonding solubility parameter δΗ of greater than 11.0, and the use of an organic solvent having a Hansen hydrogen bonding solubility parameter δΗ of greater than 11.0 as biodegradable solvent as well as the use of the composition in the manufacturing process of enameled copper wires.