Composition for forming a resist upper-layer film and method for producing a semiconductor device using the composition
申请人:NISSAN CHEMICAL INDUSTRIES, LTD.
公开号:US10042258B2
公开(公告)日:2018-08-07
This composition for forming an extreme-ultraviolet (EUV) or electron-beam upper-layer resist film including (a) a polymer (P) and (b) a solvent, the solvent containing 1 to 13 mass % of a C4-12 ketone compound with respect to the entire solvent, is used in the lithography process of a procedure for manufacturing a semiconductor device. Without needing to be intermixed with a resist, and particularly on the occasion of EUV exposure, the composition for forming an EUV or electron-beam upper-layer resist film blocks undesirable exposure light, e.g., ultraviolet (UV) or deep ultraviolet (DUV) rays, and selectively transmits only the EUV rays, and can be developed using a developing solution after exposure.
这种用于形成极紫外(EUV)或电子束上层抗蚀剂薄膜的组合物包括(a)聚合物(P)和(b)溶剂,溶剂中的C4-12酮化合物占整个溶剂的1-13质量%,用于半导体设备制造过程中的光刻工艺。这种用于形成 EUV 或电子束上层抗蚀剂薄膜的组合物无需与抗蚀剂混合,尤其是在进行 EUV 曝光时,可阻挡不希望的曝光光(例如紫外线 (UV) 或深紫外线 (DUV)),并选择性地只透射 EUV 射线,曝光后可使用显影液进行显影。