1--2,3-epoxypropane | 105886-99-5

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯酚醚
• 英文名称: 1--2,3-epoxypropane
• 英文别名: 2-[[4-(Cyclopenten-1-yl)phenoxy]methyl]oxirane
• CAS: 105886-99-5
• 化学式: C₁₄H₁₆O₂
• 分子量: 216.28
• InChiKey: OKSAJIGDXHMVPI-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.8
• 重原子数：
  16
• 可旋转键数：
  4
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.43
• 拓扑面积：
  21.8
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为反应物：
  描述：

  4-苯基-4-羟基哌啶 、 1--2,3-epoxypropane 以58%的产率得到1-[3-(4-环戊-1-烯基-苯氧基)-2-羟基-丙基]-4-苯基-哌啶-4-醇
  参考文献：
  名称：

  Kumar, Surat; Rastogi, Shri Nivas, Indian Journal of Chemistry - Section B Organic and Medicinal Chemistry, 1986, vol. 25, p. 106 - 110

  摘要：

  DOI：
• 作为产物：
  描述：

  1-(环戊烯-1-基)-4-甲氧基苯 在 吡啶盐酸盐 、 potassium carbonate 作用下， 生成 1--2,3-epoxypropane
  参考文献：
  名称：

  Kumar, Surat; Rastogi, Shri Nivas, Indian Journal of Chemistry - Section B Organic and Medicinal Chemistry, 1986, vol. 25, p. 106 - 110

  摘要：

  DOI：

文献信息

• Epoxy resin encapsulation compositions
  申请人：GENERAL ELECTRIC COMPANY

  公开号：EP1285938A1

  公开（公告）日：2003-02-26

  Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D) at least one cure modifier. The encapsulant (11) may also optionally comprise at least one of ancillary curing catalysts, thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

  已公开的环氧树脂组合物包括：(A) 至少一种环脂族环氧树脂；(B) 由六氢-4-甲基邻苯二甲酸酐组成的固化剂；(C) 至少一种基本上不含卤素的含硼催化剂；(D) 至少一种固化改性剂。 封装剂 (11) 还可选择包含辅助固化催化剂、热稳定剂、紫外线稳定剂、偶联剂或折射率改性剂中的至少一种。 还公开了封装固态器件，包括封装、芯片（4）和由本发明环氧树脂组合物组成的封装剂（11）。 还提供了一种封装固态器件的方法。
• Epoxy resin compositions and solid state devices encapsulated therewith
  申请人：GENERAL ELECTRIC COMPANY

  公开号：EP1285939A1

  公开（公告）日：2003-02-26

  Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, and, optionally (E) at least one ancillary curing catalyst. The encapsulant (11) may also optionally comprise at least one of thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

  已公开的环氧树脂组合物包括：(A) 至少一种环脂族环氧树脂；(B) 至少一种酸酐固化剂；(C) 至少一种基本上不含卤素的含硼催化剂；(D) 至少一种固化改性剂；以及(E) 可选的至少一种辅助固化催化剂。封装剂 (11) 还可选择包含热稳定剂、紫外线稳定剂、偶联剂或折射率改性剂中的至少一种。还公开了封装固态器件，包括封装、芯片（4）和由本发明环氧树脂组合物组成的封装剂（11）。还提供了一种封装固态器件的方法。
• Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method
  申请人：GENERAL ELECTRIC COMPANY

  公开号：EP1408087A1

  公开（公告）日：2004-04-14

  Epoxy resin compositions are disclosed which comprise (A) at least one silicone resin, (B) at least one epoxy resin, (C) at least one anhydride curing agent, (D) at least one siloxane surfactant, and (E) at least one ancillary curing catalyst. Also disclosed are a packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising a composition of the invention. A method of encapsulating a solid state device is also provided.

  本发明公开了环氧树脂组合物，其中包括 (A) 至少一种硅树脂、(B) 至少一种环氧树脂、(C) 至少一种酸酐固化剂、(D) 至少一种硅氧烷表面活性剂和 (E) 至少一种辅助固化催化剂。还公开了一种封装固态器件，包括封装、芯片（4）和包含本发明组合物的封装剂（11）。还提供了一种封装固态器件的方法。
• Epoxy resin compositions, solid state devices encapsulated therewith and method
  申请人：General Electric Company

  公开号：US20030071368A1

  公开（公告）日：2003-04-17

  Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D) at least one cure modifier. The encapsulant may also optionally comprise at least one of ancillary curing catalysts, thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

  已公开的环氧树脂组合物包括：(A) 至少一种环脂族环氧树脂；(B) 由六氢-4-甲基邻苯二甲酸酐组成的固化剂；(C) 至少一种基本上不含卤素的含硼催化剂；(D) 至少一种固化改性剂。封装剂还可选择包含辅助固化催化剂、热稳定剂、紫外线稳定剂、偶联剂或折射率改性剂中的至少一种。本发明还公开了封装固态器件，包括封装、芯片和由本发明环氧树脂组合物组成的封装剂。还提供了一种封装固态器件的方法。
• Curable epoxy compositions and articles made therefrom
  申请人：Rubinsztajn Slawomir

  公开号：US20050008865A1

  公开（公告）日：2005-01-13

  A curable epoxy formulation comprising at least one epoxy monomer, at least one organofunctionalized colloidal silica, at least one alkyl onium cure catalyst, and optional reagents is provided in the present invention. Also disclosed are a packaged solid state device comprising an encapsulant comprising the aforementioned curable epoxy formulation.

  本发明提供了一种可固化环氧配方，该配方包含至少一种环氧单体、至少一种有机官能化胶体二氧化硅、至少一种烷基鎓固化催化剂和任选试剂。本发明还公开了一种封装好的固态装置，该装置包含一种由上述可固化环氧配方组成的封装剂。