申请人:Bension, Rouvain M.
公开号:EP0598361A1
公开(公告)日:1994-05-25
A method for initiating and bonding thin films on substrates is described. The method employs an interlayer comprising a self-assembling monolayer (SAM). The SAM is formed from monomers, one end of which are capable of bonding to the substrate, and the other end of which form a surface similar to, and capable of initiating the formation of a film.
Additionally, compositions for monomers, methods for SAM formation, and methods for film formation are disclosed. In a preferred embodiment the thin film is comprised of diamond.
本发明涉及一种在基板上启动和结合薄膜的方法。该方法采用包含自组装单层(SAM)的中间层。SAM由单体形成,其中一端能够与基板结合,另一端形成类似于表面,并能够启动膜的形成。此外,还公开了单体的组成,SAM形成的方法以及膜形成的方法。在优选实施例中,薄膜由金刚石组成。