5,5'-diamino-2,2'-sulfonyl-di-phenol | 40475-20-5

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 5,5'-diamino-2,2'-sulfonyl-di-phenol
• 英文别名: 5-Amino-2-(4-amino-2-hydroxy-phenyl)sulfonyl-phenol；5-amino-2-(4-amino-2-hydroxyphenyl)sulfonylphenol
• CAS: 40475-20-5
• 化学式: C₁₂H₁₂N₂O₄S
• 分子量: 280.304
• InChiKey: MYQNRHKDAHFSQY-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.2
• 重原子数：
  19
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  135
• 氢给体数：
  4
• 氢受体数：
  6

反应信息

• 作为反应物：
  描述：

  5,5'-diamino-2,2'-sulfonyl-di-phenol 生成 bis-(2-acetoxy-4-acetylamino-phenyl)-sulfone
  参考文献：
  名称：

  Studies in the Sulfone Series. VII. The Preparation of 2,8-Diaminophenoxathiin-5-dioxide and Bis-(2-hydroxy-4-aminophenyl) Sulfone

  摘要：

  DOI：

  10.1021/ja01164a028
• 作为产物：
  描述：

  3’-甲氧基乙酰苯胺 在 二硫化碳 、 potassium dichromate 、 三氯化铝 、 氯化亚砜 、 硫酸 、 氢溴酸 、 溶剂黄146 作用下， 生成 5,5'-diamino-2,2'-sulfonyl-di-phenol
  参考文献：
  名称：

  Julia, Bulletin de la Societe Chimique de France, 1951, p. 37

  摘要：

  DOI：

文献信息

• Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof
  申请人：Okada Koji

  公开号：US20060199920A1

  公开（公告）日：2006-09-07

  A photosensitive resin composition according to the present invention includes at least a base resin component (A) and a (meth)acryls compound (B), wherein the base resin component (A) is any one of: a polyimide resin (A-1) having at least either a hydroxyl group or a carboxyl group in its structure; a polyamide resin (A-2) having at least either a hydroxyl group or a carboxyl group in its structure; and photosensitive imide(meth)acrylsiloxaneoligomer (A-3). On this account, it is possible to realize characteristics such as (1) realization and improvement of water system developing property, (2) improvement of utility as an imidized film, (3) improvement of post-curing property, and (4) simplification of manufacture of a print wiring substrate. Thus, the photosensitive resin composition can be favorably used particularly in a photosensitive dry film resin, a laminate using the same, a print wiring substrate using the same, and the like.

  本发明提供的一种光敏树脂组合物包括至少一种基础树脂组分(A)和一种（甲基）丙烯酸化合物(B)，其中基础树脂组分(A)是以下任何一种：具有至少一个羟基或羧基的聚酰亚胺树脂(A-1)；具有至少一个羟基或羧基的聚酰胺树脂(A-2)；和光敏亚胺（甲基）丙烯酰基硅氧烷低聚物(A-3)。因此，可以实现特性，例如(1)实现和改善水系开发性能，(2)改善作为亚胺化膜的实用性，(3)改善后固化性能，以及(4)简化印刷线路基板的制造。因此，该光敏树脂组合物可以特别有利地用于光敏干膜树脂、使用相同的层压板、使用相同的印刷线路基板等。
• NOVEL POLYIMIDE PRECURSOR COMPOSITION AND USE THEREOF
  申请人：Fujihara Kan

  公开号：US20100132989A1

  公开（公告）日：2010-06-03

  An object of the present invention is to provide a polyimide precursor composition solution that (i) uses no siloxane diamine, (ii) is curable at low temperature (not more than 250° C.) and (iii) has low viscosity regardless of its high concentration, and a photosensitive resin composition, photosensitive resin film, a thermosetting resin composition, a polyimide insulating film, and a printed wiring board with an insulating film, each of which has good physical properties and is obtained by use of the polyimide precursor composition solution. The foregoing object is attained by using a polyimide precursor composition solution which includes at least a (A) urethane imide oligomer having a terminal carboxylic acid group and a (B) diamino compound and/or isocyanate compound.

  本发明的目的是提供一种聚酰亚胺前体组成物溶液，其(i)不使用硅氧烷二胺，(ii)可在低温（不超过250℃）下固化，且(iii)具有低粘度，无论其浓度如何，并提供一种光敏树脂组成物、光敏树脂膜、热固性树脂组成物、聚酰亚胺绝缘膜以及带有绝缘膜的印制电路板，每种产品都具有良好的物理性能，并通过使用聚酰亚胺前体组成物溶液获得。通过使用聚酰亚胺前体组成物溶液，该溶液至少包括(A)具有端羧基的聚氨酯酰亚胺寡聚体和(B)二胺化合物和/或异氰酸酯化合物，从而实现了上述目的。
• PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE ADHESIVE SHEET, AND SEMICONDUCTOR DEVICES USING SAME
  申请人：Toray Industries, Inc.

  公开号：EP2492331A1

  公开（公告）日：2012-08-29

  Disclosed is a photosensitive adhesive composition including: (A) an epoxy compound, (B) a soluble polyimide having a residue of the diamine represented by the general formula (2), (C) a photopolymerizable compound, and (D) a photopolymerization initiator, wherein the epoxy compound (A) contains an epoxy compound represented by the general formula (1), and also the soluble polyimide (B) has a residue of diamine represented by the general formula (2): wherein m and n in the general formula (1) are integers of 0 or more, which satisfy the relationship: 1 ≤ m + n ≤ 10, x is an integer of 1 or more and 5 or less, y is an integer of 1 or more and 10 or less, and y = 2x; and wherein R1 to R8 in the general formula (2) may be respectively the same or different, and selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 30 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, a halogen, a sulfone group, a nitro group and a cyano group. The present invention provides a photosensitive adhesive composition which can be developed with an alkali developing solution after exposure, and exhibits high adhesive strength in case of thermocompression bonding on a substrate, and is also excellent in insulation stability.

  公开了一种光敏粘合剂组合物，包括 (A) 环氧化合物、 (B) 具有通式(2)所代表二胺残留物的可溶性聚酰亚胺、 (C) 可光聚合的化合物，和 (D) 光聚合引发剂，其中 环氧化合物（A）含有通式（1）代表的环氧化合物，可溶性聚酰亚胺（B）具有通式（2）代表的二胺残留物： 其中，通式（1）中的 m 和 n 是 0 或 0 以上的整数，它们满足以下关系：1 ≤ m + n ≤ 10，x 为 1 或 1 以上且 5 或 5 以下的整数，y 为 1 或 1 以上且 10 或 10 以下的整数，且 y = 2x；以及 其中通式（2）中的R1至R8可以分别相同或不同，并选自氢原子、具有1至30个碳原子的烷基、具有1至30个碳原子的烷氧基、卤素、砜基、硝基和氰基组成的组。本发明提供了一种光敏粘合剂组合物，曝光后可用碱显影液显影，在基材上进行热压粘合时，粘合强度高，绝缘稳定性也很好。
• Conductive-layer-integrated flexible printed circuit board
  申请人：Kaneka Corporation

  公开号：US10045433B2

  公开（公告）日：2018-08-07

  The present invention provides a conductive-layer-integrated flexible printed circuit board that has excellent electrical insulation reliability and that prevents the electrically conductive layer from being detached during a reflow process. The conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the insulator film, and (C) the wiring-pattern-equipped film being laminated in this order, (B) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within the infrared range.

  本发明提供了一种导电层集成柔性印刷电路板，它具有极佳的电气绝缘可靠性，并能防止导电层在回流焊过程中脱落。导电层集成柔性印刷电路板包括(A)电磁屏蔽导电层；(B)绝缘体薄膜；和(C)布线图案薄膜，(A)电磁屏蔽导电层、(B)绝缘体薄膜和(C)布线图案薄膜依次层叠，(B)绝缘体薄膜至少含有(a)粘合剂聚合物和(b)黑色着色剂，其反射范围在红外线范围内。
• Reinforcing-plate-integrated flexible printed circuit board
  申请人：Kaneka Corporation

  公开号：US10292262B2

  公开（公告）日：2019-05-14

  The present invention provides a stiffener-integrated flexible printed circuit board that has excellent electrical insulation reliability and that prevents the stiffener from being detached during a reflow process. The stiffener-integrated flexible printed circuit board including: (A) a stiffener, (B) a thermosetting adhesive, (C) an insulator film, and (D) a wiring-pattern-equipped film, (A) the stiffener, (B) the thermosetting adhesive, (C) the insulator film, and (D) the wiring-pattern-equipped film being laminated in this order, (C) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within the infrared range.

  本发明提供了一种集成了加强筋的柔性印刷电路板，它具有极佳的电气绝缘可靠性，并能防止加强筋在回流焊过程中脱落。硬化剂集成柔性印刷电路板包括(A)加强筋、(B)热固性粘合剂、(C)绝缘体薄膜和(D)布线图案薄膜，(A)加强筋、(B)热固性粘合剂、(C)绝缘体薄膜和(D)布线图案薄膜依次层压，(C)绝缘体薄膜至少含有(a)粘合剂聚合物和(b)黑色着色剂，其反射范围在红外线范围内。